參數(shù)資料
型號(hào): S71GL016A40BAW3J3
廠商: SPANSION LLC
元件分類(lèi): 存儲(chǔ)器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA56
封裝: 9 X 7 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-56
文件頁(yè)數(shù): 7/9頁(yè)
文件大?。?/td> 168K
代理商: S71GL016A40BAW3J3
June 20, 2006 S71GL016A_00_A1
S71GL016A Based MCPs
5
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
6.
Ordering Information
The order number is formed by a valid combinations of the following:
6.1
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Note:
Type 0 is standard. Specify other options as required.
S71GL
016
A
40
BA
W
3J
0
Packing Type
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
Model Number
See the Valid Combinations table
Temperature Range
W = Wireless (-25×C to +85×C)
Package Type
BA = Fine-pitch BGA Lead (Pb)-free compliant package
BF = Fine-pitch BGA Lead (Pb)-free package
pSRAM Density
40 = 4 Mb pSRAM
Process Technology
A = 200 nm, MirrorBit Technology
Flash Density
016= 16Mb
Product Family
S71GL Multi-chip Product (MCP) 3.0-volt Page Mode Flash Memory and RAM
Base Ordering
Part Number
Package &
Temperature
Package Modifier/
Model Number
Packing
Type
Speed Options (ns)/
Boot Sector Option
pSRAM Type/
Access Time (ns)
Package
Marking
S71GL016A40
BAW
3J
0, 2, 3
(See Note)
100 / Bottom Boot Sector
pSRAM4/ 70
TLC056
S71GL016A40
1J
100 / Top Boot Sector
S71GL016A40
BFW
3J
100 / Bottom Boot Sector
S71GL016A40
1J
100 / Top Boot Sector
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