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| 型號(hào)： | S71AL016D02-TF |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM |
| 文件頁(yè)數(shù)： | 58/76頁(yè) |
| 文件大?。?/td> | 909K |
| 代理商： | S71AL016D02-TF |
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58
S29AL016D
S29AL016D_00_A1_E August 4, 2004
A d v a n c e I n f o r m a t i o n
Erase and Programming Performance
Notes:
1. Typical program and erase times assume the following conditions: 25
°
C, V
CC
= 3.0 V, 100,000 cycles, checkerboard
data pattern.
2. Under worst case conditions of 90°C, V
CC
= 2.7 V, 1,000,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most
bytes program faster than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program
command. See Table
9
for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 100,000 cycles per sector.
TSOP and BGA Pin Capacitance
Notes:
1. Sampled, not 100% tested.
2. Test conditions T
A
= 25°C, f = 1.0 MHz.
Parameter
Typ (Note 1)
Max (Note 2)
Unit
Comments
Sector Erase Time
0.7
10
s
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time
25
s
Byte Programming Time
5
150
μs
Excludes system level
overhead (Note 5)
Word Programming Time
7
210
μs
Chip Programming Time
(Note 3)
Byte Mode
11
33
s
Word Mode
7.2
21.6
s
Parameter
Symbol
Parameter Description
Test Setup
Package
Typ
Max
Unit
C
IN
Input Capacitance
V
IN
= 0
TSOP
6
7.5
pF
BGA
4.2
5.0
pF
C
OUT
Output Capacitance
V
OUT
= 0
TSOP
8.5
12
pF
BGA
5.4
6.5
pF
C
IN2
Control Pin Capacitance
V
IN
= 0
TSOP
7.5
9
pF
BGA
3.9
4.7
pF
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