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Features
l
Large active area
S5980: 5 × 5 mm
S5981: 10 × 10 mm
S5870: 10 × 10 mm
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Chip carrier package suitable for surface mounting
Facilitates automated surface mounting by solder reflow
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Thin package: 1.26 mmt
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Photo sensitivity: 0.72 A/W (
λ
=960 nm)
I
General ratings
Parameter
Symbol
Window material
-
Gap between elements
-
Active area
A
Applications
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Laser beam axis alignment
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Level meters
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Pointing devices, etc.
P H O T O D I O D E
Si PIN photodiode
S5980, S5981, S5870
Multi-element photodiodes for surface mounting
S5980
S5981
S5870
Unit
-
μm
mm
Resin coating
30
φ
10.0/4 elements
φ
5.0/4 elements
φ
10.0/2 elements
I
Absolute maximum ratings
Parameter
Reverse voltage
Operating temperature
Storage temperature
Symbol
V
R
Max.
Topr
Tstg
S5980
S5981
30
-40 to +100
-40 to +125
S5870
Unit
V
°C
°C
I
Electrical and optical characteristics (Ta=25
°
C, per 1 element)
S5980
S5981
S5870
Parameter
Symbol
Condition
Typ.
Max.
-
Typ.
Max.
-
Typ.
Max.
-
Unit
Spectral response range
Peak sensitivity
wavelength
Photo sensitivity
Dark current
Temperature coefficient of I
D
Cut-off frequency
Terminal capacitance
Noise equivalent power
Note) S5980: For mass production, order unit is 100 pieces.
S5981, S5870: For mass production, order unit is 50 pieces.
λ
320 to 1100
320 to 1100
320 to 1100
nm
λ
p
960
-
960
-
960
-
nm
S
I
D
λ
=
λ
p
V
R
=10 V
0.72
0.3
1.15
25
10
-
2
-
-
-
-
0.72
0.6
1.15
20
35
-
4
-
-
-
-
0.72
2
1.15
10
50
-
A/W
nA
times/°C
MHz
pF
W/Hz
1/2
10
-
-
-
-
T
CID
fc
Ct
NEP
V
R
=10 V, R
L
=50
, -3 dB
V
R
=10 V, f=1 MHz
V
R
=10 V,
λ
=
λ
p
1.4 × 10
-14
1.9 × 10
-14
3.5 × 10
-14
G
The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that
can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window
to prevent such troubles.
G
Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5
seconds maximum time under the conditions that no moisture absorption occurs.
Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use.
G
Silicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol.
G
Avoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin
from absorbing moisture.
When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in
nitrogen atmosphere at 150 °C for 3 to 5 hours or at 120 °C for 12 to 15 hours before use.
Precautions for use
1