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參數(shù)資料
| 型號(hào)： | S596-10-225-08-001461 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類(lèi)： | 插座 |
| 英文描述： | BGA225, IC SOCKET |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大小： | 106K |
| 代理商： | S596-10-225-08-001461 |
Mill-Max’s 0.8mm BGA
Socket/Adapter Systems are used for both
socketing BGA devices and interconnecting
circuit boards. Systems are also available to
fit 1mm and .050” grid footprints.
For socketing BGA devices, a Socket
is reflow soldered to the same footprint as
the device using solder paste, and the
balled device is soldered to a BGA Adapter
(pin header) with either flux or paste. The
device may now be plugged into circuit.
For interconnect applications, a PCB
Adapter (pin header) is soldered to the sur-
face of the daughter card, thereby making it
pluggable into a mating Socket surface sol-
dered to the motherboard.
BGA Socket/Adapters provide a high density and low
profile interconnect system.
All pins and sockets utilized in Mill-Max BGA
Systems are precision-machined brass and plated
gold. Press-fit into every mating socket is a beryllium
copper “three-finger” contact, also gold plated (heat-
treated BeCu is the best spring material for electrical
contacts). Mill-Max #04 contact with a .010” dia.
mating pin is used for 0.8mm grid systems.
The insulator for the socket and both adapters is
.047” thick machined FR-4 glass epoxy laminate that
has a TCE to match the BGA device and circuit
board.
The mounting surfaces of the Socket are pre-
tinned to replicate solder balls. For the PCB Adapter,
pre-tinning is optional.
MAXIMUM
solutions
R
Maximum Interconnect Solutions
Mill-Max Mfg. Corp. 190 Pine Hollow Road, Oyster Bay, NY 11771-0300
516-922-6000 Fax: 516-922-9253
e-mail: techserv@mill-max.com or
sales@mill-max.com
www.mill-max.com
(11/01-528)
BGA MOUNT APPLICATIONS
PCB INTERCONNECT APPLICATIONS
MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS
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