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| 型號： | S29PL127J65 |
| 廠商： | Spansion Inc. |
| 英文描述： | CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control |
| 中文描述： | 3.0伏的CMOS只，同步讀/寫閃存與增強(qiáng)VersatileIO控制記憶 |
| 文件頁數(shù)： | 102/106頁 |
| 文件大小： | 1997K |
| 代理商： | S29PL127J65 |
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100
S29PL127J/S29PL129J/S29PL064J/S29PL032J
31107A62 April 7, 2005
P R E L I M I N A R Y
TLC056—56-Ball Fine-pitch BGA 7 x 9mm package (PL064J and PL032J)
3348 \ 16-038.22a
PACKAGE
TLC 056
JEDEC
N/A
D x E
9.00 mm x 7.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
0.20
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
9.00 BSC.
BODY SIZE
E
7.00 BSC.
BODY SIZE
D1
5.60 BSC.
MATRIX FOOTPRINT
E1
5.60 BSC.
MATRIX FOOTPRINT
MD
8
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
n
φ
b
eE
56
BALL COUNT
0.35
0.40
0.45
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A1,A8,D4,D5,E4,E5,H1,H8
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
E1
7
SE
A
D1
eD
D
C
E
F
G
H
8
7
6
4
3
2
1
eE
5
B
PIN A1
CORNER
7
SD
BOTTOM VIEW
C
0.08
0.20
C
A
E
B
C
0.15
(2X)
C
D
C
0.15
(2X)
INDEX MARK
10
6
b
TOP VIEW
SIDE VIEW
CORNER
56X
A1
A2
A
0.15 M
0.08
M
C
C
A B
PIN A1
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S29PL127J70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory with Enhanced VersatileIO Control |
| S29PL127J70BAI000 | 功能描述:閃存 128Mb 3V 70ns Parallel NOR 閃存 RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類型: 接口類型:SPI 訪問時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| S29PL127J70BAI020 | 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 128MBIT 8MX16 70NS 64FBGA - Trays |
| S29PL127J70BFI000 | 制造商:Spansion 功能描述:SPZS29PL127J70BFI000 POWER MOSFET 30 V, 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 128MBIT 8MX16 70NS 80FBGA - Trays |
| S29PL127J70TAI130 | 制造商:Spansion 功能描述: 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 128MBIT 8MX16 70NS 56TSOP - Trays |
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