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Publication Number
 S29PL-J_00
Revision
 A
Amendment
 9
Issue Date
 September 22, 2006
Distinctive Characteristics
Architectural Advantages
 128/128/64/32 Mbit Page Mode devices
– Page size of 8 words: Fast page read access from random locations 
within the page
 Single power supply operation
– Full Voltage range: 2.7 to 3.6 volt read, erase, and program operations 
for battery-powered applications
 Dual Chip Enable inputs (only in PL129J)
– Two CE# inputs control selection of each half of the memory space
 Simultaneous Read/Write Operation
– Data can be continuously read from one bank while executing erase/
program functions in another bank
– Zero latency switching from write to read operations
 FlexBank Architecture (PL127J/PL064J/PL032J)
– 4 separate banks, with up to two simultaneous operations per device
– Bank A: 
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
– Bank B: 
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
– Bank C: 
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
– Bank D: 
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
 FlexBank Architecture (PL129J)
– 4 separate banks, with up to two simultaneous operations per device
– CE#1 controlled banks:
Bank 1A: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
Bank 1B: PL129J - 48Mbit (32Kw x 96)
– CE#2 controlled banks:
Bank 2A: PL129J - 48 Mbit (32Kw x 96)
Bank 2B: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
 Enhanced VersatileI/O (V
) Control 
– Output voltage generated and input voltages tolerated on all control 
inputs and I/Os is determined by the voltage on the V
 pin
– V
options at 1.8 V and 3 V I/O for PL127J and PL129J devices
– 3V V
 for PL064J and PL032J devices
 Secured Silicon Sector region
– Up to 128 words accessible through a command sequence
– Up to 64 factory-locked words
– Up to 64 customer-lockable words
 Both top and bottom boot blocks in one device
 Manufactured on 110 nm process technology
 Data Retention: 20 years typical
 Cycling Endurance: 1 million cycles per sector typical
Performance Characteristics
 High Performance
– Page access times as fast as 20 ns
– Random access times as fast as 55 ns
 Power consumption (typical values at 10 MHz)
– 45 mA active read current 
– 17 mA program/erase current
– 0.2 μA typical standby mode current
Software Features
 Software command-set compatible with JEDEC 42.4 standard
– Backward compatible with Am29F, Am29LV, Am29DL, and AM29PDL 
families and MBM29QM/RM, MBM29LV, MBM29DL, MBM29PDL 
families
 CFI (Common Flash Interface) compliant 
– Provides device-specific information to the system, allowing host 
software to easily reconfigure for different Flash devices
 Erase Suspend / Erase Resume
– Suspends an erase operation to allow read or program operations in 
other sectors of same bank
 Program Suspend / Program Resume
– Suspends a program operation to allow read operation from sectors 
other than the one being programmed
 Unlock Bypass Program command
– Reduces overall programming time when issuing multiple program 
command sequences
Hardware Features
 Ready/Busy# pin (RY/BY#)
– Provides a hardware method of detecting program or erase cycle 
completion
 Hardware reset pin (RESET#)
– Hardware method to reset the device to reading array data
 WP#/ ACC (Write Protect/Acceleration) input
– At V
, hardware level protection for the first and last two 4K word 
sectors.
– At V
IH
, allows removal of sector protection
– At V
, provides accelerated programming in a factory setting
 Persistent Sector Protection
– A command sector protection method to lock combinations of individual 
sectors and sector groups to prevent program or erase operations within 
that sector
– Sectors can be locked and unlocked in-system at V
CC
 level
 Password Sector Protection
– A sophisticated sector protection method to lock combinations of 
individual sectors and sector groups to prevent program or erase 
operations within that sector using a user-defined 64-bit password
 Package options
– Standard discrete pinouts
11 x 8 mm, 80-ball Fine-pitch BGA (PL127J) (VBG080)
8.15 x 6.15 mm, 48-ball Fine pitch BGA (PL064J/PL032J)
(VBK048)
– MCP-compatible pinout
8 x 11.6 mm, 64-ball Fine-pitch BGA (PL127J)
7 x 9 mm, 56-ball Fine-pitch BGA (PL064J and PL032J)
Compatible with MCP pinout, allowing easy integration of RAM into 
existing designs
– 20 x 14 mm, 56-pin TSOP (PL127J) (TS056)
S29PL-J
128/128/64/32 Megabit (8/8/4/2 M x 16-Bit) 
CMOS 3.0 Volt-only, Simultaneous-Read/Write
Flash Memory with Enhanced VersatileIO Control
Data Sheet
 (Advance Information)