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參數(shù)資料
| 型號： | S29NS256P |
| 廠商： | Spansion Inc. |
| 英文描述： | MirrorBit Flash Family |
| 中文描述： | MirrorBit閃存系列 |
| 文件頁數(shù)： | 13/86頁 |
| 文件大?。?/td> | 2234K |
| 代理商： | S29NS256P |
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February 20, 2007 S29NS-P_00_A1
S29NS-P MirrorBit
TM
Flash Family
13
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
VDE44-44-Ball Very Thin Fine-Pitch Ball Grid Array, 6.2mm x 7.7 mm
Figure 4.5
VDE044—44-Ball Very Thin Fine-Pitch Ball Grid Array, S29NS128/256P
PACKAGE
VDE 044
JEDEC
N/A
7.70 mm x 6.20 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
0.86
---
1.00
OVERALL THICKNESS
A1
0.20
---
---
BALL HEIGHT
A2
0.66
0.71
0.76
BODY THICKNESS
D
7.6
7.7
7.8
BODY SIZE
E
6.1
6.2
6.3
BODY SIZE
D1
4.50
BALL FOOTPRINT
E1
1.50
BALL FOOTPRINT
MD
10
ROW MATRIX SIZE D DIRECTION
ME
4
ROW MATRIX SIZE E DIRECTION
N
φ
b
e
44
TOTAL BALL COUNT
0.25
0.30
0.35
BALL DIAMETER
0.50 BSC.
BALL PITCH
SD / SE
0.25 BSC.
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
3308.2 \ 16-038.9L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
INDEX MARK
A1 CORNER
SIDE VIEW
TOP VIEW
D
A
10
A2
A1
E
SEATING PLANE
C
0.10
C
B
A
C
0.08
BOTTOM VIEW
NF1
NF3
2
1
3
4
5
6
9
8
7
10
A
B
NF2
C
D
NF4
D1
SD
φ
b
E1
SE
1.00
e
A
M
M
C
C
φ
0.05
φ
0.15
B
A1 CORNER
7
7
6
1.00
相關PDF資料 |
PDF描述 |
|---|---|
| S29NS256P0PBJW000 | MirrorBit Flash Family |
| S29NS256P0PBJW003 | MirrorBit Flash Family |
| S29NS256P0SBJW000 | MirrorBit Flash Family |
| S29NS256P0SBJW003 | MirrorBit Flash Family |
| S29NS256PABBJW000 | MirrorBit Flash Family |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| S29NS256P0PBJW000 | 功能描述:閃存 256M (16MX16) 66MHz Simultaneous R/W RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結構:256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| S29NS256P0PBJW003 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
| S29NS256P0SBJW000 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
| S29NS256P0SBJW003 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
| S29NS256PABBJW000 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
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