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    參數(shù)資料
    

    


    


    
型號：
S29GL256M10TAIR10

    

    
廠商：
SPANSION LLC

    

    
元件分類：
DRAM

    

    
英文描述：
3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology

    

    
中文描述：
16M X 16 FLASH 3V PROM, 100 ns, PDSO56

    

    
封裝：
MO-142EC, TSOP-56

    

    
文件頁數(shù)：
146/160頁

    

    
文件大小：
2142K

    

    
代理商：
S29GL256M10TAIR10


    

    

    

	
    
    
    

    
    
	
    146
    S29GLxxxM MirrorBit
    TM
     Flash Family
    S29GLxxxM_00A5  April 30, 2004
    P r e l i m i n a r y
    Physical Dimensions
    TSR040—40-Pin Standard/Reverse Thin Small Outline Package (TSOP)
    -X-
    X = A OR B
    e/2
    DETAIL B
    c
    L
    0.25MM (0.0098") BSC
    0
    DETAIL A
    R
    GAGE LINE
    PARALLEL TO
    SEATING PLANE
    b
    b1
    (c)
    7
    6
    c1
    WITH PLATING
    BASE METAL
    7
    C A-B S
    M
    0.08MM (0.0031")
    SECTION B-B
    e
    0.10 C
    A2
    PLANE
    SEATING
    C
    A1
    SEE DETAIL B
    B
     B
    B
     B
    SEE DETAIL A
    2
    REVERSE PIN OUT (TOP VIEW)
    2
    N
    N
    1
    4
    3
    A
    -A-
    -B-
    5
    9
    E
    5
    D1
    D
    6
    2
    3
    4
    5
    7
    8
    9
    TSR 040
    MO-142 (B) EC
    40
    MIN
    0.05
    0.95
    0.17
    0.17
    0.10
    0.10
    19.80
    18.30
    9.90
    0.50
    0
    0.08
    0.50 BASIC
    0.60
    3
    MAX
    1.20
    0.15
    1.05
    0.27
    0.16
    0.21
    20.20
    5
    0.20
    18.50
    10.10
    0.70
    0.23
    0.20
    0.22
    1.00
    18.40
    10.00
    20.00
    NOM
    Symbol
    A
    Jedec
    Package
    b1
    b
    c1
    c
    A2
    A1
    D
    D1
    L
    0
    R
    N
    e
    E
    1
    NOTES:
    CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
    (DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
    NOT APPLICABLE.
    PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
    TO BE DETERMINED AT THE SEATING PLANE  -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF 
    CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT 
    HORIZONTAL SURFACE.
    DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
    0.15MM (.0059") PER SIDE.
    DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE 
    0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE 
    BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
    THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
    0.25MM (0.0098") FROM THE LEAD TIP.
    LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
    DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
    3324 \ 16-038.10a
    
    
    
    
    
    


    


    

    相關(guān)PDF資料
    		

    PDF描述
    		

    
    

    
S29GL256M10TAIR12
3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology

    

    
S29GL256M10TAIR13
3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology

    

    
S29GL256M10TAIR20
3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology

    

    
S29GL256M10TAIR22
MOSFET, Switching; VDSS (V): 200; ID (A): 0.5; Pch : -; RDS (ON) typ. (ohm) @10V: 1.6; RDS (ON) typ. (ohm) @4V[4.5V]: 1.9; RDS (ON) typ. (ohm) @2.5V: -; Ciss (pF) typ: 120; toff (&#181;s) typ: -; Package: TSSOP-8

    

    
S29GL256M10TAIR23
3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology

    

    

    

    


    


    

    相關(guān)代理商/技術(shù)參數(shù)
    		

    參數(shù)描述
    		

    
    

    
S29GL256M11FAIR10
 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 256M-Bit 32M x 8/16M x 16 110ns 64-Pin Fortified BGA Tray

    

    
S29GL256M11FAIR12
 制造商:Spansion 功能描述:256M (32MX8/16MX16) 3V REG, MIRRORBIT, FBGA64 IND - Trays

    

    
S29GL256M11FAIR2
 制造商:Spansion 功能描述:NOR Flash, 16M x 16, 64 Pin, Plastic, BGA

    

    
S29GL256M11FAIR20
 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 256M-Bit 32M x 8/16M x 16 110ns 64-Pin Fortified BGA Tray

    

    
S29GL256M11FFIR10
 制造商:Spansion 功能描述:NOR Flash Parallel 3V/3.3V 256Mbit 32M/16M x 8bit/16bit 110ns 64-Pin Fortified BGA Tray 制造商:Spansion 功能描述:Flash Memory IC

    

    
    
    
    
	
    	
    
    
     
     
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