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    • 參數(shù)資料
      型號: S29GL128M90TAIR12
      廠商: SPANSION LLC
      元件分類: DRAM
      英文描述: 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
      中文描述: 8M X 16 FLASH 3V PROM, 90 ns, PDSO56
      封裝: MO-142-EC, TSOP-56
      文件頁數(shù): 110/160頁
      文件大?。?/td> 2142K
      代理商: S29GL128M90TAIR12
      110
      S29GLxxxM MirrorBit
      TM
      Flash Family
      S29GLxxxM_00A5 April 30, 2004
      P r e l i m i n a r y
      Any commands written during the chip erase operation are ignored. However,
      note that a
      hardware reset
      immediately terminates the erase operation. If that
      occurs, the chip erase command sequence should be reinitiated once the device
      has returned to reading array data, to ensure data integrity.
      Figure 6 illustrates the algorithm for the erase operation. Refer to the Erase and
      Program Operations table in the AC Characteristics section for parameters, and
      Figure 18 section for timing diagrams.
      Sector Erase Command Sequence
      Sector erase is a six bus cycle operation. The sector erase command sequence is
      initiated by writing two unlock cycles, followed by a set-up command. Two addi-
      tional unlock cycles are written, and are then followed by the address of the
      sector to be erased, and the sector erase command. Table
      31
      and Table
      32
      shows
      the address and data requirements for the sector erase command sequence.
      The device does
      not
      require the system to preprogram prior to erase. The Em-
      bedded Erase algorithm automatically programs and verifies the entire memory
      for an all zero data pattern prior to electrical erase. The system is not required to
      provide any controls or timings during these operations.
      After the command sequence is written, a sector erase time-out of 50 μs occurs.
      During the time-out period, additional sector addresses and sector erase com-
      mands may be written. Loading the sector erase buffer may be done in any
      sequence, and the number of sectors may be from one sector to all sectors. The
      time between these additional cycles must be less than 50 μs, otherwise erasure
      may begin. Any sector erase address and command following the exceeded time-
      out may or may not be accepted. It is recommended that processor interrupts be
      disabled during this time to ensure all commands are accepted. The interrupts
      can be re-enabled after the last Sector Erase command is written.
      Any com-
      mand other than Sector Erase or Erase Suspend during the time-out
      period resets the device to the read mode.
      Note that the SecSi Sector, au-
      toselect, and CFI functions are unavailable when an erase operation is in
      progress
      .
      The system must rewrite the command sequence and any additional
      addresses and commands.
      The system can monitor DQ3 to determine if the sector erase timer has timed out
      (See the section on DQ3: Sector Erase Timer.). The time-out begins from the ris-
      ing edge of the final WE# pulse in the command sequence.
      When the Embedded Erase algorithm is complete, the device returns to reading
      array data and addresses are no longer latched. The system can determine the
      status of the erase operation by reading DQ7, DQ6, or DQ2 in the erasing sector.
      Refer to the Write Operation Status section for information on these status bits.
      Once the sector erase operation has begun, only the Erase Suspend command is
      valid. All other commands are ignored. However, note that a
      hardware reset
      im-
      mediately
      terminates the erase operation. If that occurs, the sector erase
      command sequence should be reinitiated once the device has returned to reading
      array data, to ensure data integrity.
      Figure 6 illustrates the algorithm for the erase operation. Refer to the Erase and
      Program Operations table in the AC Characteristics section for parameters, and
      Figure 18 section for timing diagrams.
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