參數(shù)資料
型號: S29GL032M11TCIR42
廠商: SPANSION LLC
元件分類: PROM
英文描述: 2M X 16 FLASH 3V PROM, 110 ns, PDSO48
封裝: LEAD FREE, TSOP-48
文件頁數(shù): 46/160頁
文件大?。?/td> 4727K
代理商: S29GL032M11TCIR42
14
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00A5 April 30, 2004
Pr e l i m i n a r y
Connection Diagrams
For S29GL064M (model R0) only.
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
C2
D2
C3
D3
E2
E3
F2
F3
G2
G3
H2
H3
J2
J3
K2
A3
A4
A2
A1
A0
CE#
OE#
VSS
A7
A18
A6
A5
DQ0
NC
DQ1
RY/BY#
ACC
NC
DQ2
DQ3
VIO
A21
WE#
RESET#
A22
NC
DQ5
NC
VCC
DQ4
A9
A8
A11
A12
A19
A10
DQ6
DQ7
A14
A13
A15
A16
A17
NC
A20
VSS
C4
D4
E4
A1
B1
A2
NC*
F4
G4
H4
J4
K4
C5
D5
E5
F5
G5
H5
J5
K5
C6
D6
E6
F6
G6
H6
J6
K6
C7
D7
E7
NC*
A7
B7
A8
B8
F7
G7
H7
J7
K7
NC*
L7
M7
L8
M8
K3
L1
L2
M1
NC*
M2
* Balls are shorted together via the substrate but not connected to the die.
63-Ball Fine-Pitch BGA
Top View, Balls Facing Down
相關(guān)PDF資料
PDF描述
S29GL064A10BAIW12 4M X 16 FLASH 3V PROM, 100 ns, PBGA64
S29GL128N11FAIVH0 16M X 16 FLASH 3V PROM, 110 ns, PBGA64
S29GL128N11FFIVH2 16M X 16 FLASH 3V PROM, 110 ns, PBGA64
S29JL032J70TFI213 2M X 16 FLASH 3V PROM, 70 ns, PDSO48
S29PL032J65BFI150 2M X 16 FLASH 3V PROM, 65 ns, PBGA56
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