參數(shù)資料
型號(hào): S29GL032M10TACR23
廠商: Spansion Inc.
英文描述: CAPACITOR, POLYMER TANTALUM, CHIP
中文描述: MirrorBit閃存系列
文件頁數(shù): 79/159頁
文件大小: 5216K
代理商: S29GL032M10TACR23
26
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00_B3 Octorber 18, 2004
Data s he et
Table 3. S29GL128M Ordering Options
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types
0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to con-
firm availability of specific valid combinations and to check on newly released combinations.
S29GL128M Valid Combinations
Package Description
Device
Number
Speed
Option
Package, Material, &
Temperature Range
Model
Number
Packing
Type
S29GL128M
90, 10, 11
TAI,TFI
R1,R2
0,2,3
(note 1)
TS056 (note 2, 3, 5)
TSOP
FAI,FFI
LAA064 (note 4)
Fortified BGA
TAI,TDI
R9
FPT-56P-M01 (note 3, 6)
TSOP
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S29GL032M10BBCR23 Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 150uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-31; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 7.3mm x 4.3mm x 2.8mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 500; Features: Low Temperature
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