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參數(shù)資料
| 型號： | S2018 |
| 廠商： | Applied Micro Circuits Corp. |
| 英文描述： | 17 × 17 3.2 Gbps Differential Crosspoint Switch(17 × 17 3.2 Gbps高速差分正交開關) |
| 中文描述： | 17 × 17 3.2 Gbps差分交叉點開關（17 × 17 3.2 Gbps的高速差分正交開關） |
| 文件頁數(shù)： | 14/21頁 |
| 文件大小： | 186K |
| 代理商： | S2018 |
14
S2018
17 X 17 3.2 GBIT/S DIFFERENTIAL CROSSPOINT SWITCH
July 25, 2000 / Revision D
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Table 7. S2018 Power Dissapation vs. Air Flow, No Heat Sink
Table 8. S2018 Power Dissapation vs. Air Flow, HTS263NF-D heat sink
THERMAL MANAGEMENT
The S2018 requires thermal management. AMCC recommends the HTS263NF-D heat sink available from
Chip Coolers
333 Strawberry Field Road
Warwick, RI 02886
The NF option refers to 'No Fan'. The HTS263NF-D package outline drawing is provided in Figure 9.
Airflow requirement is determined by
Pd = (T
j max
- T
a max
) /
θ
ja
,
θ
ja
=
θ
jc
+
θ
ca
where
T
j max
is the maximum junction temperature
T
a max
is the maximum ambient temperature
θ
ja
is the thermal dissipation coefficient from junction to ambient
θ
jc
is the thermal dissipation coefficient from junction to case
θ
ca
is the thermal dissipation coefficient from case to ambient (if a heat sink is used, this is
θ
sa
- sink to ambient)
Tables 7 and 8 show max package power vs. airlfow, calculated using the equation above with T
j max
= 125 C
and T
a max
= 70 C. In order to successfully use the S2018, the max package power must exceed the specified
max power dissipation of the device, which is determined by the output swing setting (See Table 10).
Phone: 401-739-7600 or 800-227-0254
Fax: 401-732-6119
Web: www.chipcoolers.com
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