參數(shù)資料
型號: S10201-04
廠商: Hamamatsu Photonics
英文描述: Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
中文描述: 回到清淡TDI發(fā)動機,防治荒漠化工作的后臺薄TDI的模式在防治荒漠化公約提供高靈敏度。
文件頁數(shù): 7/11頁
文件大?。?/td> 232K
代理商: S10201-04
Back-thinned TDI-CCD
S10200-02, S10201-04, S10202-08, S10202-16
7
S10201-04
KMPDA0219EA
S10202-08/-16
KMPDA0220EA
ACTIVE AREA 24.576
0.457 ± 0.05
1.27 ± 0.1
38.1 ± 0.43
40.64 ± 0.45
40
21
1
INDEX MARK
20
1
3
9
2
A
3.3 ± 0.25
1.48 ± 0.15 *
0
+
-
* Distance between window surface and photosensitive surface
ACTIVE AREA 49.152
100
51
50
55 ± 0.1
63.5 ± 0.64
66.04 ± 0.66
9
6
2
A
1
INDEX MARK
3
0.46 ± 0.25
1.27 ± 0.13
0.8 ± 0.05
2.18 ± 0.2 *
2.2 ± 0.22
3.5 ± 0.35
0
+
-
1
±
* Distance between window surface and photosensitive surface
相關(guān)PDF資料
PDF描述
S10202-08 Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
S10202-16 Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
S10317 Photo IC for laser beam synchronous detection Low voltage operation (3.3 V)
S10317-01 Photo IC for laser beam synchronous detection Low voltage operation (3.3 V)
S10 10 to 500 MHz THIN FILM SPST SWITCH
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S10202-08 制造商:HAMAMATSU 制造商全稱:Hamamatsu Corporation 功能描述:Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
S10202-16 制造商:HAMAMATSU 制造商全稱:Hamamatsu Corporation 功能描述:Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.
S102031MS02Q 功能描述:滑動開關(guān) SPDT 6A PC THRU HOLE RoHS:否 制造商:C&K Components 觸點形式:SPDT 開關(guān)功能:Momentary 觸點額定值: 端接類型: 執(zhí)行器:Extended, Side 安裝風格:SMD/SMT 觸點電鍍:Silver 封裝:
S102031MS02QE 功能描述:滑動開關(guān) Slide RoHS:否 制造商:C&K Components 觸點形式:SPDT 開關(guān)功能:Momentary 觸點額定值: 端接類型: 執(zhí)行器:Extended, Side 安裝風格:SMD/SMT 觸點電鍍:Silver 封裝:
S102031SS03Q 功能描述:滑動開關(guān) Slide SPDT 6A SOLDER LUG RoHS:否 制造商:C&K Components 觸點形式:SPDT 開關(guān)功能:Momentary 觸點額定值: 端接類型: 執(zhí)行器:Extended, Side 安裝風格:SMD/SMT 觸點電鍍:Silver 封裝: