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參數(shù)資料
| 型號： | RP-21007D1-330Y |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 模擬信號調(diào)理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, DMA10 |
| 封裝： | DIP-10 |
| 文件頁數(shù)： | 12/12頁 |
| 文件大?。?/td> | 86K |
| 代理商： | RP-21007D1-330Y |
9
ORDERING INFORMATION
RP-210XXDX-XX0X
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
K = One Lot Date Code
W = One Lot Date Code and PreCap Source
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, PreCap Source and 100% Pull Test
Blank = None of the Above
Process Requirements:
0 = Standard DDC Processing, no Burn-In (See table below.)
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In (See table below.)
Temperature Grade/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
8 = 0°C to +70°C with Variables Test Data
Options:
0 = Standard Product
1 = TTL Schmitt
2 = CMOS I/O
Package:
D = DIP
Current Regulation:
02 = 2 Amps
05 = 5 Amps
07 = 7 Amps**
10 = 10 Amps
15 = 15 Amps
25 = 25 Amps
*Standard DDC Processing with burn-in and full temperature test — see table below.
**Contact factory for availability.
STANDARD DDC PROCESSING
MIL-STD-883
TEST
METHOD(S)
CONDITION(S)
INSPECTION
2009, 2010, 2017, and 2032
—
SEAL
1014
A and C
TEMPERATURE CYCLE
1010
C
CONSTANT ACCELERATION
2001
A
BURN-IN
1015, Table 1
—
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