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參數(shù)資料
| 型號： | RMPA0963 |
| 廠商： | FAIRCHILD SEMICONDUCTOR CORP |
| 元件分類： | 衰減器 |
| 英文描述： | Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module |
| 中文描述： | 824 MHz - 849 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封裝： | 4 X 4 MM, 1.50 MM HEIGHT, LEAD FREE, LCC-10 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大小： | 128K |
| 代理商： | RMPA0963 |
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www.fairchildsemi.com
RMPA0963
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Application Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE
Precautions to Avoid Permanent Device Damage:
Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. Devices should remain in their orig-
inal packaging until component placement to ensure no con-
tamination or damage to RF, DC & ground contact areas.
Device Cleaning: Standard board cleaning techniques should
not present device problems provided that the boards are
properly dried to remove solvents or water residues.
Static Sensitivity: Follow ESD precautions to protect against
ESD damage:
A properly grounded static-dissipative surface on which to
place devices.
Static-dissipative floor or mat.
A properly grounded conductive wrist strap for each per-
son to wear while handling devices.
General Handling: Handle the package on the top with a vac-
uum collet or along the edges with a sharp pair of bent twee-
zers. Avoiding damaging the RF, DC, & ground contacts on
the package bottom. Do not apply excessive pressure to the
top of the lid.
Device Storage: Devices are supplied in heat-sealed, mois-
ture-barrier bags. In this condition, devices are protected and
require no special storage conditions. Once the sealed bag
has been opened, devices should be stored in a dry nitrogen
environment.
Device Usage:
Fairchild RF recommends the following procedures prior to
assembly.
Dry-bake devices at 125°C for 24 hours minimum. Note: The
shipping trays cannot withstand 125°C baking temperature
Assemble the dry-baked devices within 7 days of removal
from the oven.
During the 7-day period, the devices must be stored in an
environment of less than 60% relative humidity and a max-
imum temperature of 30°C
If the 7-day period or the environmental conditions have
been exceeded, then the dry-bake procedure must be
repeated.
Solder Materials & Temperature Profile:
Reflow soldering is the preferred method of SMT attachment.
Hand soldering is not recommended.
Reflow Profile
Ramp-up: During this stage the solvents are evaporated
from the solder paste. Care should be taken to prevent
rapid oxidation (or paste slump) and solder bursts caused
by violent solvent out-gassing. A typical heating rate is 1-
2°C/sec.
Pre-heat/soak: The soak temperature stage serves two
purposes; the flux is activated and the board and devices
achieve a uniform temperature. The recommended soak
condition is: 120-150 seconds at 150°C.
Reflow Zone: If the temperature is too high, then devices
may be damaged by mechanical stress due to thermal
mismatch or there may be problems due to excessive sol-
der oxidation. Excessive time at temperature can enhance
the formation of inter-metallic compounds at the lead/
board interface and may lead to early mechanical failure of
the joint. Reflow must occur prior to the flux being com-
pletely driven off. The duration of peak reflow temperature
should not exceed 10 seconds. Maximum soldering tem-
peratures should be in the range 215-220°C, with a maxi-
mum limit of 225°C.
Cooling Zone: Steep thermal gradients may give rise to
excessive thermal shock. However, rapid cooling promotes a
finer grain structure and a more crack-resistant solder joint.
The illustration below indicates the recommended soldering
profile.
Solder Joint Characteristics: Proper operation of this device
depends on a reliable void-free attachment of the heatsink to
the PWB. The solder joint should be 95% void-free and be a
consistent thickness.
Rework Considerations: Rework of a device attached to a
board is limited to reflow of the solder with a heat gun. The
device should not be subjected to more than 225°C and
reflow solder in the molten state for more than 5 seconds. No
more than 2 rework operations should be performed.
Recommended Solder Reflow Profile
0
20
40
60
80
100
120
140
DEG (°C)
TIME (SEC)
10 SEC
183°C
1°C/SEC
1°C/SEC
SOAK AT 150°C
FOR 60 SEC
45 SEC
(MAX)
ABOVE
183°C
160
180
200
220
240
0
60
120
180
240
300
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參數(shù)描述 |
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| RMPA0965 | 功能描述:射頻放大器 CDMA-CDMA2000-1X Pwr Edge Amp Mod RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| RMPA0966 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:WCDMA Band V Power Amplifier Module |
| RMPA0966_07 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:WCDMA Band V Power Amplifier Module |
| RMPA0967 | 功能描述:射頻放大器 CDMA2000-1X-WCDMA Pwr Edge Amp Mod RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| RMPA0967_06 | 制造商:FAIRCHILD 制造商全稱:Fairchild Semiconductor 功能描述:Cellular CDMA, CDMA2000-1X and WCDMA Power Edg TM Power Amplifier Module |
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