
In our continuing strategy to deliver unparalleled circuit protection solutions,
technical expertise and application leadership, we proudly introduce the
WICKMANN Group and its products to the Littelfuse portfolio.
040706
www.littelfuse.com
P
OLYFUSE
R
ESETTABLE
F
USES
Dimensions (mm)
Speci
fi
cations
Packaging
A*
G
F*
* preferred type
Materials
Insulating Material: Yellow Epoxy Polymer,
Round Pins:
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 oC to +85 oC (consider derating)
Humidity Ageing
+85 °C, 85% R.H., 1000 hours, ± 5 % typical
resistance change
Soldering Characteristics
Solderability per MIL-STD-202, Method 208E
Thermal Shock
MIL-STD-202F, Method 107G
+125 °C to -40 °C 10 times, ±5 % typical resistance
change
Solvent Resistance
MIL-STD-202, Method 215F, no change
Marking
“P”, voltage, amperage rating, lot number
bulk
tape and reel
tape and ammo
UL 94 V-0
Copper alloy, tin plated
USB Type, 6 V / 16V
Standard
UL 1434 1
st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TüV
Features
This new radial leaded products are designed
speci
fi
cally for Universal Serial Bus (USB) applia-
tions with low resistance, faster time-to-trip and low
voltage drop features.
RLD-USB
Dimensions (mm)
Model
Fig.
A
B
C
typ
D
E
Physical Characteristics
Lead
Material
packaging quantity
bag
Max
Max
Min
Max
ammo
RLD06P075B
RLD06P120B
RLD06P155B
RLD16P090B
RLD16P110B
RLD16P135B
RLD16P160B
RLD16P185B
RLD16P250B
2
2
2
1
1
1
1
1
1
6.9
6.9
6.9
7.4
7.4
8.9
8.9
10.2
11.4
11.4
11.7
11.7
12.2
14.2
13.5
15.2
15.7
18.3
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
5.1
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
7.6
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
3.0
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
0.51 dia.
Sn/Cu
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
Sn/CuFe
500
500
500
500
500
500
500
500
500
2,000
2,000
2,000
2,000
2,000
2,000
2,000
2,000
2,000
RLD06P075B
RLD06P120B
RLD06P155B
RLD16P090B
RLD16P110B
RLD16P135B
RLD16P160B
RLD16P185B
RLD16P250B
0.75
1.20
1.55
0.90
1.10
1.35
1.60
1.85
2.50
1.30
2.00
2.70
1.80
2.20
2.70
3.20
3.70
5.00
6
6
6
40
40
40
40
40
40
40
40
40
0.40 @ 8.00
0.50 @ 8.00
0.60 @ 8.00
5.90 @ 4.50
6.60 @ 5.50
7.30 @ 6.75
8.00 @ 8.00
8.70 @ 9.25
10.3 @ 12.5
0.3
0.6
0.6
0.6
0.7
0.8
0.9
1.0
1.2
0.100
0.065
0.040
0.070
0.050
0.040
0.030
0.030
0.020
0.230
0.140
0.100
0.180
0.140
0.120
0.110
0.090
0.060
16
16
16
16
16
16
c
T
Permissible continuous operating current is
≤
100 % at ambient temperature of 20 oC (68 oF).
Model
I
I
(A)
(A)
NOTE:
I
hold
=
I
trip
=
V
max
=
I
max
=
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum voltage device can withstand without damage at rated current (I
)
Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
=
R
min
=
R
=
Caution: Operation beyond the speci
fi
ed rating may result in damage and possible arcing and
fl
ame.
Speci
fi
cations are subject to change without notice
Power dissipated from device when in the tripped state at 20 °C still air.
Minimum resistance of device in initial (un-soldered) state.
Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Figure 1
Figure 2
V
max. dc
I
(A)
max. time to trip
(s @ A)
P
Resistance
(W)
R
min.
( )
Approvals
R
I max.
( )
Order
Information
Qty.
Order-
Number
Model
* Packaging
* optional "F" for lead free devices