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參數(shù)資料
| 型號： | RKP409KS |
| 廠商： | Renesas Technology Corp. |
| 英文描述： | LIN fail-safe system basis chip, SOT864-1 (HTSSOP24), Tube Dry Pack |
| 中文描述： | 綜合PIN二極管的天線開關 |
| 文件頁數(shù)： | 2/6頁 |
| 文件大小： | 77K |
| 代理商： | RKP409KS |
RKP409KS
REJ03G1501-0200 Rev.2.00 Jun 08, 2007
Page 2 of 5
Absolute Maximum Ratings
(Ta = 25
°
C)
Unit
V
mA
mW
°
C
°
C
Item
Symbol
Value
30
100
100
125
55 to +125
Reverse voltage
Forward current
Power dissipation
Junction temperature
Storage temperature
Note: Per one device
V
R
I
F
Pd *
Tj
Tstg
Electrical Characteristics (HVL147M Series)
(Ta = 25
°
C)
Item
Symbol
I
R
V
F
C
r
f1
r
f2
—
Min
—
—
—
—
—
100
Typ
—
—
—
—
—
—
Max
100
1.0
0.31
2.5
1.5
—
Unit
nA
V
pF
V
Test Condition
Reverse current
Forward voltage
Capacitance
Forward resistance
V
R
= 30 V
I
F
= 10 mA
V
R
= 1 V, f = 1 MHz
I
F
= 2 mA, f = 100 MHz
I
F
= 10 mA, f = 100 MHz
C = 200 pF, R = 0
, Both forward
and reverse direction 1 pulse.
ESD-Capability *
1
Electrical Characteristics (RKP201KN Series)
(Ta = 25
°
C)
Item
Symbol
I
R
V
F
C
r
f
—
Min
—
—
—
—
100
Typ
—
—
—
—
—
Max
100
0.9
0.35
2.0
—
Unit
nA
V
pF
V
Test Condition
Reverse current
Forward voltage
Capacitance
Forward resistance
ESD-Capability *
1
V
R
= 30 V
I
F
= 2 mA
V
R
= 1 V, f = 1 MHz
I
F
= 2 mA, f = 100 MHz
C = 200 pF, R = 0
, Both forward
and reverse direction 1 pulse.
Notes
:
1. Failure criterion ; I
R
>
100 nA at V
R
= 30 V
2. For MFP12 package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip
part is considered as unquestioned. Please kindly consider soldering nature.
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相關代理商/技術參數(shù) |
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|---|---|
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