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參數(shù)資料
| 型號： | RF3315 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 衰減器 |
| 英文描述： | ROADBAND HIGH LINEARITY AMPLIFIER |
| 中文描述： | 200 MHz - 3000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT, SOT-89, 3 PIN |
| 文件頁數(shù)： | 12/12頁 |
| 文件大小： | 228K |
| 代理商： | RF3315 |
4-568
RF3315
Rev A9 050310
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.
Thermal Pad and Via Design
Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating
routing strategies.
The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
A = 1.37 x 0.96 (mm) Typ.
Dimensions in mm.
Pin 1
A
A
1.48
3.48
2.892.44
1.020.48
5.46
1.88 Typ.
0.72 Typ.
0.03
Figure 2. PCB Solder Mask Pattern (Top View)
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相關(guān)代理商/技術(shù)參數(shù) |
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| RF331-5 | 制造商:Teledyne Relays 功能描述:RF RELAY |
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| RF3315-000 | 制造商:TE Connectivity 功能描述:- Tape and Reel |
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