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參數(shù)資料
| 型號(hào)： | RF2690 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | W-CDMA RECEIVE AGC AND DEMODULATOR |
| 中文描述： | TELECOM, CELLULAR, BASEBAND CIRCUIT, QCC20 |
| 封裝： | 4 X 4 MM, LCC-20 |
| 文件頁(yè)數(shù)： | 1/16頁(yè) |
| 文件大?。?/td> | 259K |
| 代理商： | RF2690 |
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7-39
7
Q
D
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
7
G
Gain
Control
Div
4
I/Q
Cal
Mode Control
& Biasing
8
L
4
W-CDMA IN+
2
NC
6
V
20
V
1
V
17
I
18
14 I OUT+
15 ENCAL
16 FCLK
11 Q OUT-
19 VREF2V
10
E
3
NC
5
W-CDMA IN-
9
E
12 Q OUT+
13 I OUT-
I
RF2690
W-CDMA RECE IVE AGC
AND DEMODULAT OR
W-CDMA Systems
The RF2690 is an integrated complete IF AGC amplifier
and quadrature demodulator designed for the receive
section of W-CDMA applications. It is designed to amplify
received IF signals, while providing 70dB of gain control
range, a total of 90dB gain, and demodulation to base-
band I and Q signals. This circuit is designed as part of
RFMD’s single mode W-CDMA chipset, which includes
the RF9678 as modulator and IF AGC and the RF2638 as
upconvertor. The IC is manufactured on an advanced
25GHz F
T
Silicon Bi-CMOS process, and is packaged in
a 20-pin, 4mmx4mm, leadless chip carrier.
Digitally Controlled Power Down Mode
2.7V to 3.3V Operation
Digital LO Quadrature Divide-by-4
IF AGC Amp with 70dB Gain Control
80dB Maximum Voltage Gain
RF2690
RF2690 PCBA
W-CDMA Receive AGC and Demodulator
Fully Assembled Evaluation Board
7
Rev A4 010918
1.00
0.90
4.00
sq.
0.60
0.24 typ
3
0.20
0.75
0.50
0.23
0.13
4 PLCS
0.50
2.10
sq.
0.65
4 PLCS
0.05
12°
MAX
Dimensions in mm.
Note orientation of package.
NOTES:
Shaded lead is Pin 1.
1
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
2
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
Package S tyle: LCC , 20-Pin, 4 x 4
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