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參數(shù)資料
| 型號： | REG1117FA-5.0 |
| 英文描述： | 800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85V, 3.3V, 5V, and Adjustable |
| 中文描述： | 800mA電流和1A低壓差穩(wěn)壓積極在1.8V，2.5V，工作在2.85V，3.3V和5V和可調(diào) |
| 文件頁數(shù)： | 10/16頁 |
| 文件大小： | 264K |
| 代理商： | REG1117FA-5.0 |
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SBVS001D OCTOBER 1992 REVISED JULY 2004
www.ti.com
10
The SOT-223 package derives heat sinking from
conduction through its copper leads, especially the large
mounting tab. These must be soldered to a circuit board
with a substantial amount of copper remaining, as shown
in Figure 5. Circuit board traces connecting the tab and the
leads should be made as large as practical. The mounting
tab of both packages is electrically connected to V
OUT
.
Total Area: 50 x 50mm
35 x 17 mm
16 x 10 mm
16 x 10 mm
Without backside copper:
With solid backside copper:
JA
≈
59 C/W
JA
≈
49 C/W
Figure 5. SOT-223 Circuit Board Layout Example
Other nearby circuit traces, including those on the back
side of the circuit board, help conduct heat away from the
device, even though they may not be electrically
connected. Make all nearby copper traces as wide as
possible and leave only narrow gaps between traces.
Table 1 shows approximate values of
JA
for various circuit
board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting
conditions, and ventilation can dramatically affect the
actual
JA
. Proper heat sinking significantly increases the
maximum power dissipation at a given ambient
temperature, as shown in Figure 6.
Table 1. SOT-223
JA
for Various Board
Configurations
SOT-223
THERMAL
RESISTANCE
JUNCTION-
TO-AMBIENT
46
°
C/W
TOTAL PC
BOARD
AREA
2500mm2
2500mm2
2500mm2
2500mm2
2500mm2
1600mm2
2500mm2
2500mm2
1600mm2
900mm2
900mm2
TOPSIDE(1)
COPPER
AREA
2500mm2
1250mm2
950mm2
2500mm2
1800mm2
600mm2
1250mm2
915mm2
600mm2
340mm2
340mm2
BACKSIDE
COPPER
AREA
2500mm2
2500mm2
2500mm2
47
°
C/W
49
°
C/W
0
51
°
C/W
0
53
°
C/W
55
°
C/W
1600mm2
0
58
°
C/W
59
°
C/W
0
0
67
°
C/W
900mm2
72
°
C/W
85
°
C/W
0
(1)Tab is attached to the topside copper.
SOLDERING METHODS
Both REG1117 packages are suitable for infrared reflow
and vapor-phase reflow soldering techniques. The high
rate of temperature change that occurs with wave
soldering or hand soldering can damage the REG1117.
INSPEC Abstract Number: B91007604, C91012627.
Kelly, E.G. “Thermal Characteristics of Surface 5WK9
Packages.” The Proceedings of SMTCON. Surface Mount
Technology Conference and Exposition: Competitive
Surface Mount Technology, April 36, 1990, Atlantic City,
NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago,
IL, USA.
6
5
4
3
2
1
0
P
0
25
50
75
100
125
Ambient Temperature ( C)
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
P
D
= (T
(max)
T
)/
JA
T
J
(max) = 150 C
DDPAK
SOT223
= 85 C/W
(340mm
topside copper,
no backside copper)
= 46 C/W
(2500mm
topside and
backside copper)
= 27 C/W
(4in
2
one oz copper
mounting pad)
JA
= 65 C/W
(no heat sink)
Figure 6. Maximum Power Dissipation versus Ambient Temperature
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| REG1117FA500 | 制造商:BB 制造商全稱:BB 功能描述:800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable |
| REG1117FA-500 | 制造商:BB 制造商全稱:BB 功能描述:800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable |
| REG1117FA500G3 | 制造商:BB 制造商全稱:BB 功能描述:800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable |
| REG1117FA-5500 | 制造商:BB 制造商全稱:BB 功能描述:800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable |
| REG1117FA-5KTTT | 制造商:BB 制造商全稱:BB 功能描述:800mA and 1A Low Dropout Positive Regulator 1.8V, 2.5V, 2.85, 3.3V, 5V, and Adjustable |
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