
PACKAGE INFORMATION
Power Dissipation (SON1612-6)
PE-SON1612-6-0510
This specification is at mounted on board.
Power Dissipation (P
D
) depends on conditions of mounting on board. This specification is based on the
measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment
Mounting on Board (Wind velocity=0m/s)
Board Material
Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm
×
40mm
×
1.6mm
Copper Ratio
Top side : Approx. 50%, Back side : Approx.50%
Through-hole
φ
0.5mm
×
24pcs
Measurement Result
(Topt=25
°
C,Tjmax=125
°
C)
Standard Land Pattern
Power Dissipation
Thermal Resistance
θ
ja
=
(125
25
°
C)/0.5W
=
200
°
C/W
600
500mW
0
50
100
25
75 85
125
150
Ambient Temperature (
°
C)
Power Dissipation
0
200
100
300
400
500
P
D
(
On Board
4
39
3
2
40
27
Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.5
0.28
0
0
(Unit: mm)