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參數(shù)資料
| 型號： | RA48110-D12D |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 102K |
| 代理商： | RA48110-D12D |
Specifications are subject to change without notice (30.06.1999)
3
45.5 **
5.3
2xM5
LED
2xM3
12
13 **
3
2
5
4
1
6
3
APPLY
HEATSINK
COMPOUND
RA 23, RA 40, RA 48, RA 60
Dimensions
Weight
Housing material
Base plate
10 A, 25 A, 50 A
90 A, 110 A
Potting compound
Relay
Mounting screws
Mounting torque
Control terminal
Mounting screws
Mounting torque
Power terminal
Mounting screws
Mounting torque
Approx. 110 g
Noryl GFN 1, black
Aluminium, nickel-plated
Copper, nickel-plated
Polyurethane
M5
1.5 Nm
M3 x 6
0.5 Nm
M5 x 6
2.4 Nm
Housing Specifications
** =
±
0.4 mm
***=
±
0.5 mm
Applications
Thermal characteristics
The thermal design of Solid
State Relays is very impor-
tant. It is essential that the user
makes sure that cooling is ad-
equate and that the maximum
junction temperature of the re-
lay is not exceeded.
This relay is designed for use
in applications in which it is
exposed to high surge condi-
tions. Care must be taken to
ensure
proper
when the relay is to be used at
high sustained currents. Ade-
quate electrical connection
between relay terminals and
cable must be ensured.
heatsinking
Heat flow
Heatsink
temperature
R
th
j-c
R
th
c-s
R
th
s-a
Junction
temperature
Case
temperature
Ambient
temperature
Thermal resistance:
R
th
j-c = junction to case
Direct bonding
In the design of the output
power semiconductor direct
bonding of the copper layer
and the ceramic substrate has
been applied. This is to en-
sure uninhibited heat transfer
and high thermal fatigue
strength.
The relay has been designed
for applications requiring large
numbers of load cycles.
Power dissipation
The power dissipation for in-
termittent use is calculated ac-
cording to the following for-
mula:
t
on
t
off
OFF
ON
I
rms
=
I
ON2
x t
ON
t
ON
+ t
OFF
Ex: RA 23 50 -D 06D:
Load current = 45 A
t
ON
= 30 s
t
OFF
= 15 s
I
rms
=
45
2
x 30
30 + 15
The rms current will be
36.7 A.
If the heatsink is placed in a
small closed room, control
panel or the like, the power
dissipation can cause the
ambient temperature to rise.
The heatsink is to be cal-
culated on the basis of the
ambient temperature and the
increase in temperature.
R
th
c-s = case to heatsink
R
th
s-a = heatsink to ambient
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