參數(shù)資料
型號(hào): R5F213J2CNNP
元件分類: 微控制器/微處理器
英文描述: MICROCONTROLLER, QCC36
封裝: 6 X 6 MM, 0.50 MM PITCH, QFN-36
文件頁數(shù): 6/23頁
文件大?。?/td> 613K
代理商: R5F213J2CNNP
14
MOUNTING
The package bolts to part of the chassis or even the motor
assembly itself, depending on system requirements. in applica-
tions where this isn’t convenient, the hybrid can be mounted to
its own heatsink. The heat transfer in a hybrid is from semicon-
ductor junction to the bottom of the hybrid case. The flatness
and maximum temperature of this mounting surface are critical
to proper performance and reliability, because this is the only
method of dissipating the power created in the hybrid. Use a
mounting surface flatness of 0.004 inches/inch maximum. This
interface can be improved with the use of a thermal compound
or pad. The heatsink should be designed to insure that the case
temperature does not exceed +125°C.
TABLE 3. INPUT-OUTPUT TRUTH TABLE
INPUTS
OUTPUTS
UPPERS
LOWERS
CONTROL
VUA
VUB
VUC
VLA
VLB
VLC
VSd
VO A VO B VO C
1
0
1
0
H
L
Z
1
0
1
0
H
Z
L
0
1
0
1
0
Z
H
L
0
1
0
1
0
L
H
Z
0
1
0
L
Z
H
0
1
0
1
0
Z
L
H
0
1
0
L
H
0
1
0
1
0
1
0
L
H
L
0
1
0
L
H
1
0
1
0
H
L
1
0
1
0
1
0
H
L
H
1
0
1
0
H
L
x
1
0
1
0
x
1
0
1
0
1
x
1
0
1
x
0
1
0
1
0
1
0
1
x
0
1
0
1
0
x
0
1
0
1
0
1
0
1
0
Z
H
L
Z
H
Z
H
L
Z
H
L
Z
H
Z
L
Z
H
Z
H
L
Z
L
H
Z
H
Z
H =High Level, L = Low Level, X =Irrelevant, Z =High Impedance
TABLE 4. PIN ASSIGNMENTS
PIN
FUNCTION
PIN
FUNCTION
1
VSS C
26
GND
2
VO C
25
VUC
3
VCC C
24
VLC
4
N/C
23
VSd
5
VSS B
22
GND
6
VO B
21
VUB
7
VCC B
20
VLB
8
VSS A
19
GND
9
VO A
18
VUA
10
N/C
17
VLA
11
VCC A
16
VLPI
12
Vb
15
VLPO
13
Vz
14
N/C
Notes: 1. Pins 3, 7, and 11 are internally connected.
2. Pins 19, 22 and 26 are internally connected.
FIGURE 21. PWR-82331/82333 MECHANICAL
OUTLINE
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