參數資料
| 型號： | QII-0.006-00-54 |
| 廠商： | Bergquist |
| 文件頁數： | 1/1頁 |
| 文件大?。?/td> | 0K |
| 描述： | THERMAL PAD TO-220 .006" |
| 標準包裝： | 500 |
| 系列： | Q-Pad® II |
| 使用： | TO-220 |
| 形狀： | 矩形 |
| 外形： | 19.05mm x 12.70mm |
| 厚度： | 0.006"（0.152mm） |
| 材質： | 鋁 |
| 顏色： | 黑 |
| 熱電阻系數： | 0.22°C/W |
| 導熱性： | 2.5 W/m-K |
| 其它名稱： | Q2-54 Q4329428 T0802145 |
www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_QP_II_12.08
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company - Asia
Room 15, 8/F Wah Wai Industrial Centre
No. 38-40, Au Pui Wan Street
Fotan, Shatin, N.T. Hong Kong
Ph: 852.2690.9296
Fax: 852.2690.2344
Q-Pad II
Foil-Format Grease Replacement for Maximum Heat Transfer
Features and Benefits
Thermal impedance:
0.22°C-in2/W (@50 psi)
Maximum heat transfer
Aluminum foil coated both sides
Designed to replace thermal grease
Q-Pad II is a composite of aluminum foil coated
on both sides with thermally / electrically
conductive Sil-Pad rubber.The material is
designed for those applications in which maxi-
mum heat transfer is needed and electrical
isolation is not required. Q-Pad II is the ideal
thermal interface material to replace messy
thermal grease compounds.
Q-Pad II eliminates problems associated with
grease such as contamination of reflow solder
or cleaning operations. Unlike grease, Q-Pad II
can be used prior to these operations. Q-Pad II
also eliminates dust collection which can cause
possible surface shorting or heat buildup.
Typical Applications Include:
Between a transistor and a heat sink
Between two large surfaces such as an L-bracket and the chassis of an assembly
Between a heat sink and a chassis
Under electrically isolated power modules or devices such as resistors,
transformers and solid state relays
Configurations Available:
Sheet form, die-cut parts and roll form
With or without pressure sensitive adhesive
Building a Part Number
Standard Options
Sil-Pad
: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
TYPICAL PROPERTIES OF Q-PAD II
PROPERTY
IMPERIAL VALUE
METRIC VALUE
TEST METHOD
Color
Black
Visual
Reinforcement Carrier
Aluminum
—
Thickness (inch) / (mm)
0.006
0.152
ASTM D374
Hardness (Shore A)
93
ASTM D2240
Continuous Use Temp (°F) / (°C)
-76 to 356
-60 to 180
—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Non-Insulating
ASTM D149
Dielectric Constant (1000 Hz)
NA
ASTM D150
Volume Resistivity (Ohm-meter)
10
2
10
2
ASTM D257
Flame Rating
V-O
U.L.94
THERMAL
Thermal Conductivity (W/m-K)
2.5
ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi)
10
25
50
100
200
TO-220 Thermal Performance (°C/W)
2.44
1.73
1.23
1.05
0.92
Thermal Impedance (°C-in2/W) (1)
0.52
0.30
0.22
0.15
0.12
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.
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