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QESM08
SMD
2.5x2.0 Crystal – Ceramic SMD packaged
Specification (rev-A)
J
anuary 25
th, 2008
3
TEMEX reserves the right to modify herein specifications and informations at any time when necessary to provide optimum performance and cost.
Freque ncy
Item
Code
Dimension
Tolerance
Pitch of components
P
4.0
± 0.1
Pitch of sprocket hole
Po
4.0
± 0.1
Length from hole center to component center
P1
2.0
± 0.1
Width of carrier tape
W
8.0
± 0.3
Width of adhesive tape
W0
3.5
± 0.1
Height of component hole
A
2.8
± 0.1
Width of component hole
B
2.3
± 0.1
Gap of hold down tape and carrier tape
W2
0.5
± 0.1
Diameter of sprocket hole
Do
1.5
± 0.05
Diameter of feed hole
D1
1.5
± 0.25
Total of tape thickness
K
1.0
± 0.1
Tape Drawing
Reel Drawing
1.6
60
178
9.5
13.5
21.6
2.5
Multiple :
3000pcs per reel