參數(shù)資料
型號(hào): Q67120-C1054
廠商: SIEMENS AG
英文描述: High Speed CMOS Logic Triple 3-Input NOR Gates 14-SOIC -55 to 125
中文描述: 高速CMOS邏輯三倍3輸入非門 SOIC-14封裝 工作溫度:-55℃_125℃
文件頁(yè)數(shù): 22/24頁(yè)
文件大?。?/td> 980K
代理商: Q67120-C1054
C167CS-xC Bare Die
Step BA
Data Sheet
18
V1.0, 2001-08
Table 7
The wafers are glued to a plastic tape which is fixed within a plastic ring (see
Figure 5
).
Wafers can be shipped in one piece or sawn into individual dies.
Note: Please refer also to the document "
Bare Die Packing Information
".
Wafer Characteristics
Item
Chips per wafer
Metallization layers
Metallization material
Metallization thickness
Metallization barrier material
Metallization isolation
Metallization material on pads
Passivation
Backside metallization
1)
Inkdot diameter
Characteristic
262 (geometrically)
2
AlCu
Met1: 450 nm, Met2: 800 nm
Ti
SOG-CMP
AlSiCu (Al 98.5% - SI 1% - Cu 0.5%)
Oxide (300 nm) + nitride (500 nm)
None (silicon)
1.0 - 1.3 typical
1)
The backside of the chip can either be left unconnected or must be connected to
V
SS
.
相關(guān)PDF資料
PDF描述
Q67120-C302 High Speed CMOS Logic 4-Bit Binary Full Adder with Fast Carry 16-SOIC -55 to 125
Q67120-C321 High Speed CMOS Logic 4-Bit Binary Full Adder with Fast Carry 16-SOIC -55 to 125
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