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參數(shù)資料
| 型號(hào)： | Q67060-S7403-A2 |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 元件分類： | 通用總線功能 |
| 英文描述： | High Speed CMOS Logic Decade Counter/Divider with 10 Decoded Outputs 16-TSSOP -55 to 125 |
| 中文描述： | 智能高側(cè)電源開關(guān)一個(gè)頻道：60mз狀態(tài)反饋 |
| 文件頁數(shù)： | 3/13頁 |
| 文件大?。?/td> | 240K |
| 代理商： | Q67060-S7403-A2 |
BTS428L2
Infineon Technologies AG
Page 3
2003-Oct-01
Maximum Ratings
at
T
j
= 25 °C unless otherwise specified
Parameter
Supply voltage
(overvoltage protection see page 4)
Supply voltage for full short circuit protection
T
j Start
=-40 ...+150°C
Load dump protection
1
)
V
LoadDump
= V
A
+
V
s
, V
A
= 13.5 V
R
I
Load current
(Current limit, see page 5)
Operating temperature range
Storage temperature range
Power dissipation (DC), T
C
≤
25 °C
Maximal switchable inductance, single pulse
Vbb = 12V,
T
j,start = 150°C,
T
C = 150°C const.
(See diagram on page 9)
I
L(ISO) = 7 A, RL = 0
;
E
4
)
AS
=0.19J:
Electrostatic discharge capability (ESD)
(Human Body Model)
out to all other pins shorted:
acc. MIL-STD883D, method 3015.7 and
ESD assn. std. S5.1-1993; R=1.5k
; C=100pF
Input voltage (DC)
Current through input pin (DC)
Current through status pin (DC)
see internal circuit diagrams page 8
Symbol
V
bb
V
bb
Values
Unit
43
24
V
V
2
)
= 2
,
R
L
= 4.0
,
t
d
= 200 ms, IN= low or high
V
Load dump
3
)
60
V
I
L
T
j
T
stg
P
tot
Z
L
V
ESD
self-limited
-40 ...+150
-55 ...+150
A
°C
75
W
5.6
1.0
4.0
8.0
mH
kV
IN:
ST:
V
IN
I
IN
I
ST
-10 ... +16
V
±
2.0
±
5.0
mA
Thermal Characteristics
Parameter and Conditions
Thermal resistance
Symbol
R
thJC
R
thJA
Values
typ
Unit
min
max
1.67
75
--
chip - case:
junction - ambient (free air):
device on pcb
5
):
--
--
--
--
--
42
K/W
1
) Supply voltages higher than V
bb(AZ)
require an external current limit for the GND and status pins (a 150
resistor for the GND connection is recommended).
2
)
R
I
= internal resistance of the load dump test pulse generator
3
)
V
Load dump
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
4
)
E
is the maximum inductive switch-off energy
5
) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70
μ
m thick) copper area for Vbb
connection. PCB is vertical without blown air.
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