參數(shù)資料
型號(hào): Q62703-Q1640
廠商: SIEMENS AG
英文描述: LIGHT EMITTING DIODES
中文描述: 發(fā)光二極管
文件頁數(shù): 8/8頁
文件大?。?/td> 552K
代理商: Q62703-Q1640
Semiconductor Group
8
LSG K370, LSP K370, LOP K370, LOG K370
Relativer Lichtstrom
Φ
V
/
Φ
V(25 C)
=
f
(
T
A
)
Relative luminous flux
I
F
= 15 mA
Mazeichnung
Package Outlines
(Mae in mm, wenn nicht anders angegeben)
(Dimensions in mm, unless otherwise specified)
Kathodenkennzeichnung:
rot bzw. orange
grün bzw. pure green
kürzerer Ltspie
lngerer Ltspie
Cathode mark:
red or orange
green or pure green
shorter solder lead
longer solder lead
G
相關(guān)PDF資料
PDF描述
Q62703-Q1749 LC 3 mm T1 LED, Diffused Low Current LED
Q62703-Q1750 LC 3 mm T1 LED, Diffused Low Current LED
Q62703-Q1751 LC 5 mm T1 3/4 LED, Diffused Low Current LED
Q62703-Q1752 Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 75pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: 100% Tin (Sn); Body Dimensions: 0.080" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: M Failure Rate
Q62703-Q1753 Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 75pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder Coated (Sn/Pb, 70/30); Body Dimensions: 0.080" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: M Failure Rate
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