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    參數(shù)資料
    型號(hào): PX-7000-EBT-DXCB-15M0000000
    廠商: VECTRON INTERNATIONAL
    元件分類: XO, clock
    英文描述: CRYSTAL OSCILLATOR, CLOCK, 15 MHz, TTL OUTPUT
    文件頁(yè)數(shù): 3/5頁(yè)
    文件大?。?/td> 376K
    代理商: PX-7000-EBT-DXCB-15M0000000
    Vectron International 267 Lowell Road, Hudson, NH 03051 Tel: 1-88-VECTRON-1 http://www.vectron.com
    Parameter
    Min
    Typ
    Max
    Units
    Condition
    Signal
    LVDS
    Load
    60
    100
    140
    ohm
    Between outputs
    Signal Level (Vol)
    1.2
    VDC
    Signal Level (Voh)
    1.4
    VDC
    Di erential Voltage (Vod)
    240
    330
    460
    mVpeak
    Common Mode (O set) Voltage (Vos)
    1.125
    1.2
    1.375
    V
    Start-up Time
    10
    ms
    Rise \ Fall Time
    600
    1000
    ps
    measured @ 20% to 80% of Vod
    Duty cycle
    45
    55
    %
    @ 50% of Vod
    Jitter (rms)
    5
    1
    ps
    BW = 10Hz to 20 MHz
    BW = 12KHz to 20 MHz
    Period Jitter (pk-pk)
    40
    ps
    10,000 Samples - Rising edge
    Absolute Maximum Ratings
    Supply voltage (Vs)
    7.0
    V
    with Vs=5.0VDC and 3.3 VDC
    Operable temperature range
    -55
    +125
    °C
    Storage temperature range
    -62
    +125
    °C
    Additional Parameters
    Screening
    Vectron Veri cation
    Class B, MIL-PRF-55310, Rev.D
    Output Enable
    Logic “0“ input = Outputs disabled (Tri-state)
    Logic “1“ or
    oating input = Outputs enabled)
    Standard (CMOS and LVDS)
    Logic “0“ or
    oating input = Outputs enabled
    Logic “1“ input = Outputs disabled (Tri-state)
    Standard (LVPECL)
    Weight
    < 2 grams
    Processing & Packing
    Handling & processing note
    Standard Environmentals
    Vibration
    MIL-STD-202, Method 204, Condition G (30 G, 10Hz-2000Hz)
    Shock
    MIL-STD-202, Method 213, Condition I (100 G, 6ms, Sawtooth)
    Acceleration
    MIL-STD-883, Method 2001, Condition A (5000 G, Y1 Plane)
    Temperature Cycling
    MIL-STD-883, Method 1010, Condition B
    Thermal Shock
    MIL-STD-883, Method 107, Condition B
    Solderability
    MIL-STD-202, Method 208
    Leak Test (Fine and Gross)
    MIL-STD-883, Method 1014, Condition A1 and C1
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