參數(shù)資料
型號(hào): PTD08A210WACT
廠商: TEXAS INSTRUMENTS INC
元件分類(lèi): 電源模塊
英文描述: DC-DC REG PWR SUPPLY MODULE
封裝: ROHS COMPLIANT, PLASTIC, DIP MODUAL-16
文件頁(yè)數(shù): 11/15頁(yè)
文件大?。?/td> 325K
代理商: PTD08A210WACT
V
IN
V
IN
1
2
3
4
5
6
7
8
PGND
PWM
PGND
16
15
14
13
12
11
10
9
V
OUT
PGND
T
SENSE
SRE
I
SENSE
FF
AGND
V
OUT
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
TOP VIEW
BOTTOM VIEW
AGND
Thermal Pad
www.ti.com
SLTS300 – SEPTEMBER 2010
TERMINAL FUNCTIONS
TERMINAL
DESCRIPTION
NAME
NO.
VIN
1, 2
The positive input voltage power node to the module, which is referenced to common GND.
3, 7, 8, 13,
PGND
The common ground connection for the VI and VO power connections.
14
VOUT
15, 16
The regulated positive power output with respect to GND.
ISENSE
11
Current sense output. The voltage level on this pin represents the average output current of the module.
PWM
4
The PWM input pin. It is a high impedance digital input that accepts 3.3-V or 5-V logic level signals up to 1 MHz.
Current limit fault flag. The Fault signal is a 3.3-V digital output which is latched high after an over-current condition.
FF
6
The Fault is reset after a complete PWM cycle without an over-current condition (falling edge of the PWM).
Synchronous Rectifier Enable. This pin is a high impedance digital input. A 3.3 V or 5 V logic level signals is used
SRE
5
to enable the synchronous rectifier switch. When this signal is high, the module will source and sink output current.
When this signal is low, the module will only source current.
AGND
9, 10
Analog ground return. It is the 0 Vdc reference for the control inputs.
TSENSE
12
Temperature sense output. The voltage level on this pin represents the temperature of the module.
This pad is electrically connected to PGND and is the primary thermal conduction cooling path for the module. This
Thermal
pad should be soldered to a grounded copper pad on the host board. For optimum cooling performance, the
Pad
grounded copper pad should also be tied with multiple vias to the host board internal ground plane. See the Land
Pattern drawing for package ECY for recommended pad dimensions.
XX
Copyright 2010, Texas Instruments Incorporated
5
Product Folder Link(s): PTD08A210W
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