參數(shù)資料
型號(hào): PT4741N
廠商: TEXAS INSTRUMENTS INC
元件分類: 電源模塊
英文描述: 4-OUTPUT 70 W DC-DC REG PWR SUPPLY MODULE
文件頁(yè)數(shù): 7/14頁(yè)
文件大?。?/td> 321K
代理商: PT4741N
For technical support and more information, see inside back cover or visit www.ti.com
Pin Function
1+Vin
2–Vin
3
EN 2
4
EN 1
5
Do Not Connect
6
Do Not Connect
7
Do Not Connect
8
Do Not Connect
9
Do Not Connect
PT4741—48V
70-W Quad-Output
DC/DC Converter for DSL
On/Off Enable Logic
Pin Configuration
Pin Descriptions
Pin 3
Pin 4
Output Status
×1
Off
10
On
Off
Notes:
Logic 1 =Open collector
Logic 0 = –Vin (pin 2) potential
For positive Enable function, connect pin 4
to pin 2 and use pin 3.
For negative Enable function, leave pin 3
open and use pin 4.
+Vin:
The positive input supply for the module with
respect to –Vin. When powering the module from a
–48V telecom central office supply, this input is
connected to the primary system ground.
–Vin:
The negative input supply for the module, and
the 0VDC reference for the EN 1, and EN 2 inputs.
When powering the module from a +48V supply,
this input is connected to the 48V(Return).
EN 1:
The negative logic input that activates the
module output. This pin must be connected to –Vin
to enable the module’s outputs. A high impedance
disables the module’s outputs.
EN 2:
The positive logic input that activates the
module output. If not used, this pin should be left
open circuit. Connecting this input to –Vin disables
the module’s outputs.
+Vo 1:
This is the positive high-output voltage. It is
the balanced compliment of (–Vo1) and referenced
to the secondary COM node.
–Vo 1:
The negative high-output voltage, which is the
balanced compliment of (+Vo1) with respect to COM.
+Vo 2:
This is the positive low-output voltage. It is
the balanced complement of (–Vo2) and referenced
to the secondary COM node.
–Vo 2:
The negative low-output voltage, which is the
balanced compliment of (+Vo2) with respect to COM.
COM:
This is the common node and the secondary
reference for all four regulated output voltages. It
provides a return for any unbalanced load current,
and is DC isolated from the input supply pins.
±Vo1 Adjust:
Using a single resistor, this pin allows
the simultaneous adjustment of both +Vo1 and -Vo1
magnitude with respect to the COM node. Adjust-
ment can be higher or lower than the preset value.
If not used this pin should be left open circuit.
±Vo2 Adjust:
Using a single resistor, this pin allows
the simultaneous adjustment of both +Vo2 and -Vo2
magnitudes with respect to the COM node. Adjust-
ment can be higher or lower than the preset value.
If not used this pin should be left open circuit.
Note: Shaded functions indicate those pins that are at primary-side potential.
Pin Function
19
COM
20
–Vo1
21
±Vo1 Adjust
22
Do Not Connect
23
+Vo2
24
COM
25
–Vo2
26
±Vo2 Adjust
Pin Function
10
Do Not Connect
11
Pin Not Present
12
Pin Not Present
13
Pin Not Present
14
Pin Not Present
15
Pin Not Present
16
Pin Not Present
17
Pin Not Present
18
+Vo1
SLTS167A - APRIL 2002 - REVISED NOVEMBER 2002
Environmental Specifications
Characteristics
Symbols
Conditions
Min
Typ
Max
Units
Operating Temperature Range
Ta
Over Vin Range
–40
85 (i)
°C
Solder Reflow Temperature
Treflow
Surface temperature of module pins or case
215 (ii)
°C
Storage Temperature
Ts
–40
125
°C
Reliability
MTBF
Per Bellcore TR-332
1.6
106 Hrs
50% stress, Tc =40°C, ground benign
Mechanical Shock
Per Mil-STD-883D, Method 2002.3
1 msec, Sine, mounted
TBD
G’s
Mechanical Vibration
Mil-STD-883D, Method 2007.2
Suffix N
TBD (iii)
G’s
20-2000 Hz
Suffix A, C
TBD (iii)
Weight
Vertical/Horizontal
90
grams
ShutdownTemperature
OTP
115
125
°C
Flammability
Meets UL 94V-O
Notes:
(i) See SOA curves or consult factory for appropriate derating.
(ii) During solder reflow of SMD package version, do not elevate the module case, pins, or internal component temperatures above a peak of 215°C. For
further guidance refer to the application note, “Reflow Soldering Requirements for Plug-in Power Surface Mount Products,” (SLTA051).
(iii) Only the case pins on through-hole pin configurations (N & A) must be soldered. For more information see the applicable package outline drawing.
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