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PT2309 V1.2 
- 10 - 
August, 2006
Headphone Driver IC 
PT2309
Symbol 
A 
A1 
A2 
b 
b1 
b2 
b3 
c 
c1 
D 
D1 
E 
E1 
e 
eA 
eB 
eC 
L 
Min. 
- 
0.015 
0.115 
0.014 
0.014 
0.045 
0.030 
0.008 
0.008 
0.355 
0.005 
0.300 
0.240 
Nom. 
- 
- 
0.130 
0.018 
0.018 
0.060 
0.039 
0.010 
0.010 
0.365 
- 
0.310 
0.250 
0.100 bsc. 
0.300 bsc. 
- 
- 
0.130 
Max. 
0.210 
- 
0.195 
0.022 
0.020 
0.070 
0.045 
0.014 
0.011 
0.400 
0.325 
0.280 
- 
0.430 
0.060 
0.150 
0.000 
0.115 
Note: 
1. Controlling Dimensions: INCHES. 
2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 
3. Symbols are defined in the “MO Series Symbol LIST” in Section 2.2 of Publication No.95. 
4. Dimension A, A1 and L are measured with the package seated in JEDEC Seating Plane Gauge 
GS-3. 
5. D, D1 and  E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall 
not exceed 0.010 inch. 
6. E and eA measured with the leads constrained to be perpendicular to data -c- . 
7. eB and eC are measured at the lead tips with the leads unconstrained. 
8. N is the number of leads (N=8) 
9. Pointed or rounded lead tips are preferred to ease insertion. 
10. b2 and b3 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not 
exceed 0.010 inch (0.25mm) 
11. Variation BA has a b3 dimension and is 1/2 lead package. 
12. Distance between the leads including dambar protrusions to be 0.005 inch minimum. 
13. Datum plane -H-  coincident with the bottom of lead, where lead exits the body. 
14. Refer to JEDEC MS-001, Variation BA. 
JEDEC is the registered trademark of JEDEC SOLID STATE TECHNOLOGY ASSOCIATION.