參數(shù)資料
型號: PS7341-1B-A
元件分類: 繼電器,輸入/輸出模塊
英文描述: TRANSISTOR OUTPUT SOLID STATE RELAY, 3750 V ISOLATION-MAX
封裝: LEAD FREE, DIP-6
文件頁數(shù): 3/14頁
文件大小: 101K
代理商: PS7341-1B-A
Data Sheet PN10307EJ02V0DS
11
PS7341-1B,PS7341L-1B
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
Peak reflow temperature
260
°C or below (package surface temperature)
Time of peak reflow temperature
10 seconds or less
Time of temperature higher than 220
°C
60 seconds or less
Time to preheat temperature from 120 to 180
°C
120
±30 s
Number of reflows
Two
Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
220C
Package
Surface
Temperature
T
(C)
Time (s)
(heating)
to 10 s
to 60 s
260C MAX.
Recommended Temperature Profile of Infrared Reflow
120±30 s
(preheating)
180C
120C
(2) Wave soldering
Temperature
260
°C or below (molten solder temperature)
Time
10 seconds or less
Preheating conditions
120
°C or below (package surface temperature)
Number of times
One
Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by soldering iron
Peak temperature (lead part temperature)
350
°C or below
Time (each pins)
3 seconds or less
Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100
°C.
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