參數(shù)資料
型號: PS21313
廠商: Mitsubishi Electric Corporation
英文描述: TRANSFER-MOLD TYPE INSULATED TYPE
中文描述: 轉讓模具類型絕緣型
文件頁數(shù): 1/9頁
文件大?。?/td> 184K
代理商: PS21313
MIMITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>
ININSULATED TYPE
Aug. 1999
PS21313
INTEGRATED POWER FUNCTIONS
3rd generation IGBT inverter bridge for 3 phase DC-to-AC
power conversion.
APPLICATION
AC200V three-phase inverter drive for small power motor control.
Fig. 1 PACKAGE OUTLINES
PS21313
TRTRANSFER-MOLD TYPE
INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS
For upper-leg IGBT
S
:Drive circuit, High voltage isolated high-speed level shifting, Control circuit under-voltage (UV) protection.
Note : Bootstrap supply scheme can be applied.
For lower-leg IGBT
S
: Drive circuit, Control circuit under-voltage protection (UV), Short-circuit protection (SC).
Fault signaling : Corresponding to a SC fault (Low-side IGBT) or a UV fault (Low-side IGBT).
Input interface : 5V line CMOS/TTL compatible, Schmitt Trigger receiver circuit.
*
Note:
The values used in the above figure are tentative.
(3.556)
(0.5)
(1.656)
(3.556)
(1)
(6.25)
(
(
(1.778)
(1.778
×
26)
(6.25)(6.25)
16
17
18
13
14
15
10
9 8 7
6 5 4
3 2 1
11
12
19
20
21
22
23
24
35
34
33
32
31
26 25
27
28
29
30
(8)
(8)
(5)
(
(
(
(
(1.25)
(2.5)
(
(35°)
A
(
(
PCB
PATTERN
SLIT
TERMINAL
(0.5)
TERMINAL CODE
1 VUFS
2 (UPG)
3 VUFB
4 VP1
5 (COM)
6 UP
7 VVFS
8 (VPG)
9 VVFB
10 VP1
11 (COM)
12 VP
13 VWFS
14 (WPG)
15 VWFB
16 VP1
17 (COM)
18 WP
19 (UNG)
20 VNO(NC)
21 UN
22 VN
23 WN
24 FO
25 CFO
26 CIN
27 VNC
28 VN1
29 (WNG)
30 (VNG)
31 P
32 U
33 V
34 W
35 N
(PCB LAYOUT)
Detail A
(1)
(1.9)
(
(1.8MIN)
(0.5)
(1)
HEAT SINK SIDE
Type name , Lot No.
DUMMY PIN
(
φ
2DEPTH2)
(
φ
33)
HEAT SINK SIDE
*Note2
(7.62
×
4)
(41)
(42)
(49)
(7.62)
(4MIN)
*Note1:(***) = Dummy Pin.
*Note 2: In order to increase the surface distance between terminals, cut a slit, etc. on the PCB surface
when mounting a module.
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