參數(shù)資料
型號(hào)： PM50CLA060
廠商： Mitsubishi Electric Corporation
英文描述： FLAT-BASE TYPE INSULATED PACKAGE
中文描述： 平性基地型絕緣包裝
文件頁數(shù)： 3/6頁
文件大?。?/td> 97K
代理商： PM50CLA060
MITSUBISHI <INTELLIGENT POWER MODULES>
PM50CLA060
FLAT-BASE TYPE
INSULATED PACKAGE
Apr. 2004
Parameter
Symbol
Supply Voltage Protected by
SC
Supply Voltage (Surge)
Module Case Operating
Temperature
Storage Temperature
Isolation Voltage
Condition
V
CC(surge)
T
C
T
stg
V
iso
Ratings
V
CC(PROT)
400
500
–
20 ~ +100
–
40 ~ +125
2500
Unit
V
°
C
°
C
V
rms
V
V
D
= 13.5 ~ 16.5V, Inverter Part,
T
j
= +125
°
C Start
Applied between : P-N, Surge value
(Note-1)
60Hz, Sinusoidal, Charged part to Base, AC 1 min.
(Note-1) Tc (base plate) measurement point is below.
2.1
2.0
3.3
2.4
0.4
1.0
2.5
1.0
1
10
Min.
—
—
—
0.5
—
—
—
—
—
—
Typ.
1.6
1.5
2.2
1.0
0.2
0.4
1.2
0.5
—
—
Max.
Collector-Emitter
Saturation Voltage
FWDi Forward Voltage
Collector-Emitter
Cutoff Current
–
I
C
= 50A, V
D
= 15V, V
CIN
= 15V
(Fig. 2)
T
j
= 25
°
C
T
j
= 125
°
C
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C, unless otherwise noted)
INVERTER PART
Parameter
Symbol
Condition
V
CE(sat)
I
CES
V
EC
t
on
t
rr
t
c(on)
t
off
t
c(off)
Limits
T
j
= 25
°
C
T
j
= 125
°
C
Switching Time
V
D
= 15V, V
CIN
= 0V
15V
V
CC
= 300V, I
C
= 50A
T
j
= 125
°
C
Inductive Load
(Fig. 3,4)
V
CE
= V
CES
, V
CIN
= 15V
(Fig. 5)
V
D
= 15V, I
C
= 50A
V
CIN
= 0V, Pulsed
(Fig. 1)
TOTAL SYSTEM
V
mA
V
μ
s
Unit
0.95*
1.61*
1.24
2.09
0.038
°
C/W
R
th(j-c)Q
R
th(j-c)F
R
th(j-c)Q
R
th(j-c)F
R
th(c-f)
Inverter IGBT part (per 1/6)
Inverter FWDi part (per 1/6)
Inverter IGBT part (per 1/6)
Inverter FWDi part (per 1/6)
Case to fin, (per 1 module)
Thermal grease applied
(Note-2)
(Note-2)
(Note-1)
(Note-1)
(Note-1)
Symbol
Condition
Unit
Min.
—
—
—
—
—
—
—
—
—
—
Junction to case Thermal
Resistances
THERMAL RESISTANCES
Contact Thermal Resistance
* If you use this value, R
th(f-a)
should be measured just under the chips.
(Note-2) Tc (under the chip) measurement point is below.
UP
IGBT
29.0
–
7.3
1.6
Y
Parameter
Limits
Typ.
Max.
VP
WP
UN
VN
WN
FWDi
29.5
IGBT
64.6
–
7.3
FWDi
65.1
2.1
IGBT
85.9
–
7.3
FWDi
86.4
2.1
IGBT
38.1
5.3
FWDi
37.6
–
4.6
IGBT
54.8
5.3
FWDi
55.3
–
4.6
IGBT
76.1
5.3
FWDi
75.6
–
4.6
arm
axis
X
Top view
Tc
B
N
P
U
V
W
(unit : mm)
Bottom view
相關(guān)PDF資料
PDF描述
PM50CLA120 FLAT-BASE TYPE INSULATED PACKAGE
PM50CLA120_05 FLAT-BASE TYPE INSULATED PACKAGE
PM50CLB120_05 FLAT-BASE TYPE INSULATED PACKAGE
PM50CTJ060-3 INSULATED PACKAGE FLAT-BASE TYPE
PM50CTK060 FLAT-BASE TYPE INSULATED PACKAGE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PM50CLA120 功能描述:MOD IPM L-SER 6PAC IPM 1200V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動(dòng)器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM50CLA120_05 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
PM50CLB060 功能描述:MOD IPM L-SER 6PAC IPM 600V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動(dòng)器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM50CLB120 功能描述:MOD IPM L-SER 6PAC IPM 1200V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動(dòng)器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM50CLB120_05 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*