參數(shù)資料
型號： PM50B5L1C060
元件分類： 運(yùn)動控制電子
英文描述： AC MOTOR CONTROLLER, DMA19
封裝： 90 X 50 MM, DMA-19
文件頁數(shù)： 6/12頁
文件大?。?/td> 343K
代理商： PM50B5L1C060
3
MITSUBISHI <INTELLIGENT POWER MODULES>
PM50B5L1C060
FLAT-BASE TYPE
INSULATED PACKAGE
Jan. 2011
CONTROL PART
Symbol
Parameter
Conditions
Ratings
Unit
VD
Supply Voltage
Applied between : VUP1-VUPC, VVP1-VVPC,VN1-VNC
20
V
VCIN
Input Voltage
Applied between : UP-VUPC, VP-VVPC, UN
VNWN -VNC
20
V
VFO
Fault Output Supply Voltage
Applied between : UFo-VUPC, VFo-VVPC, Fo-VNC
20
V
IFO
Fault Output Current
Sink current at UFo, VFo, Fo terminals
20
mA
TOTAL SYSTEM
Symbol
Parameter
Conditions
Ratings
Unit
VCC(PROT)
Supply Voltage Protected by
SC
VD =13.5V ~ 16.5V
Inverter Part, Tj =+125°C Start
450
V
VCC(surge)
Supply Voltage (Surge)
Applied between : P-N, Surge value
500
V
Tstg
Storage Temperature
-40 ~ +125
°C
Visol
Isolation Voltage
60Hz, Sinusoidal, RMS, Charged part to Base, AC 1min.
2500
V
*: TC measurement point is just under the chip.
THERMAL RESISTANCE
Limits
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
Rth(j-c)Q
Inverter, IGBT (per 1 element)
(Note.1)
-
0.74
Rth(j-c)D
Inverter, FWDi (per 1 element)
(Note.1)
-
1.28
Rth(j-c)Q
Converter, IGBT (per 1 element)
(Note.1)
-
0.74
Rth(j-c)D
Converter, FWDi (per 1 element)
(Note.1)
-
1.28
Rth(j-c)D
Thermal Resistance
Converter, Di (per 1 element)
(Note.1)
-
1.28
Rth(c-s)
Contact Thermal Resistance
Case to heat sink, (per 1 module)
Thermal grease applied
(Note.1)
-
0.06
-
K/W
Note.
1: If you use this value, Rth(s-a) should be measured just under the chips.
相關(guān)PDF資料
PDF描述
PM6641TR SWITCHING REGULATOR, 1100 kHz SWITCHING FREQ-MAX, QCC48
PM6641 SWITCHING REGULATOR, 1100 kHz SWITCHING FREQ-MAX, QCC48
PM6670ASTR 3 A SWITCHING CONTROLLER, QCC24
PM6670AS 3 A SWITCHING CONTROLLER, QCC24
PM6670A 1.4 A SWITCHING CONTROLLER, QCC24
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PM50B5LA060 功能描述:MOD PV-IPM H-BRDG/CHOP 600V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM50B5LA060_11 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
PM50B5LB060 功能描述:MOD PV-IPM H-BRDG/CHOP 600V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊
PM50B5LB060_11 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE TYPE INSULATED PACKAGE
PM50B6L1C060 制造商:Powerex Power Semiconductors 功能描述:MOD IPM H-BRIDGE CHOPP 50A 600V 制造商:Powerex Power Semiconductors 功能描述:IGBT Module 制造商:Powerex Power Semiconductors 功能描述:IGBT Module; DC Collector Current:50A; Collector Emitter Voltage Vces:1.9V; Collector Emitter Voltage V(br)ceo:600V; Leaded Process Compatible:Yes; Module Configuration:Six; Package / Case:90 x 50mm Module ;RoHS Compliant: Yes
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*