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| 型號： | PM450CLA120 |
| 廠商： | Mitsubishi Electric Corporation |
| 英文描述： | INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| 中文描述： | 智能功率模塊扁平性基地型絕緣包裝 |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 146K |
| 代理商： | PM450CLA120 |
MITSUBISHI <INTELLIGENT POWER MODULES>
PM450CLA120
FLAT-BASE TYPE
INSULATED PACKAGE
Jul. 2005
Parameter
Symbol
Supply Voltage Protected by
SC
Supply Voltage (Surge)
Storage Temperature
Isolation Voltage
Condition
V
CC(surge)
T
stg
V
iso
Ratings
V
CC(PROT)
800
1000
–
40 ~ +125
2500
Unit
V
°
C
V
rms
V
V
D
= 13.5 ~ 16.5V, Inverter Part,
T
j
= +125
°
C Start
Applied between : P-N, Surge value
60Hz, Sinusoidal, Charged part to Base, AC 1 min.
TOTAL SYSTEM
0.05
0.09
0.014
°
C/W
R
th(j-c)Q
R
th(j-c)F
R
th(c-f)
Inverter IGBT (per 1 element)
Inverter FWDi (per 1 element)
Case to fin, (per 1 module)
Thermal grease applied
(Note-1)
(Note-1)
(Note-1)
Symbol
Condition
Unit
Min.
—
—
—
—
—
—
Junction to case Thermal
Resistances
THERMAL RESISTANCES
Contact Thermal Resistance
Parameter
Limits
Typ.
Max.
(Note-1) Tc measurement point is just under the chip.
If you use this value, R
th(f-a)
should be measured just under the chips.
UP
IGBT
30.1
82.7
VP
WP
UN
VN
WN
FWDi
19.2
82.7
IGBT
80.1
82.7
FWDi
69.2
82.7
IGBT
130.1
82.7
FWDi
119.2
82.7
IGBT
19.8
27.2
FWDi
30.7
27.2
IGBT
69.8
27.2
FWDi
80.7
27.2
IGBT
119.8
27.2
FWDi
130.7
27.2
arm
axis
X
Y
2.3
2.4
3.9
2.5
0.8
1.0
3.5
1.2
1
10
Min.
—
—
—
0.5
—
—
—
—
—
—
Typ.
1.8
1.9
2.8
1.0
0.5
0.4
2.3
0.7
—
—
Max.
Collector-Emitter
Saturation Voltage
FWDi Forward Voltage
Collector-Emitter
Cutoff Current
–
I
C
= 450A, V
D
= 15V, V
CIN
= 15V
(Fig. 2)
T
j
= 25
°
C
T
j
= 125
°
C
ELECTRICAL CHARACTERISTICS
(Tj = 25
°
C, unless otherwise noted)
INVERTER PART
Parameter
Symbol
Condition
V
CE(sat)
I
CES
V
EC
t
on
t
rr
t
c(on)
t
off
t
c(off)
Limits
T
j
= 25
°
C
T
j
= 125
°
C
Switching Time
V
D
= 15V, V
CIN
= 0V
15V
V
CC
= 600V, I
C
= 450A
T
j
= 125
°
C
Inductive Load
(Fig. 3, 4)
V
CE
= V
CES
, V
CIN
= 15V
(Fig. 5)
V
D
= 15V, I
C
= 450A
V
CIN
= 0V
(Fig. 1)
V
mA
V
μ
s
Unit
(Unit : mm)
Table 1: T
C
(under the chip) measurement point is below.
7
1
6
Name
plate
side
Bottom
view
13
Y
X
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