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參數(shù)資料
| 型號(hào)： | PKM4402NGPIPLA |
| 廠商： | ERICSSON POWER MODULES AB |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 480 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT PACKAGE-6 |
| 文件頁數(shù)： | 2/19頁 |
| 文件大小： | 1104K |
| 代理商： | PKM4402NGPIPLA |
Ericsson Internal
PRODUCT SPECIFICATION
7 (8)
Prepared (also subject responsible if other)
No.
MPM/BK Johan Hgberg
2/1301-BMR 647 Uen
Approved
Checked
Date
Rev
Reference
MPM/BK (Natalie Johansson)
(MICBACK)
2007-05-16
C
5:1 Typical Characteristics at at V
I = 55 V
PKM 4402NG PI
Output Power Derating, open frame
Thermal Resistance, open frame
0
100
200
300
400
0
2040
6080
100 [°C]
[W]
3.0 m/s
2.5 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
0
2
4
6
8
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0 [m/s]
[°C/W]
Available output power vs. ambient air temperature and airflow at
VI = 55 V. See Thermal Consideration section.
PCB to ambient thermal resistance vs. airspeed measured at the
converter. Tested in wind tunnel with airflow and test conditions as
per the Thermal consideration section.
Output Power Derating, base plate option
Thermal Resistance, base plate option
0
100
200
300
400
0
2040
6080
100 [°C]
[W]
3.0 m/s
2.5 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
0
2
4
6
8
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0[m/s]
[°C/W]
Available output power vs. ambient air temperature and airflow at
VI = 55 V. See Thermal Consideration section.
Base plate to ambient thermal resistance vs. airspeed measured at
the converter. Tested in wind tunnel with airflow and test conditions
as per the Thermal consideration section.
Output Power Derating, base plate option with heat sink*
Thermal Resistance, base plate option with heat sink*
0
100
200
300
400
0
2040
6080
100 [°C]
[W]
3.0 m/s
2.5 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
0
2
4
6
8
10
0.0
0.5
1.0
1.5
2.0
2.5
3.0[m/s]
[°C/W]
Available output power vs. ambient air temperature and airflow at
VI = 55 V. See Thermal Consideration section.
Base plate to ambient thermal resistance vs. airspeed measured at
the converter. Tested in wind tunnel with airflow and test conditions
as per the Thermal consideration section.
*
) Heat sink: finned aluminium, height: 0.23”; Thermal pad: thermal conductivity: 6W/mK, thickness: 0.25mm; Mounting: two M3 screws, torque: 0.44Nm
E
PKM 4402NG PI
IBC 5:1 Ratio, Input 38-55 V, Output up to 63A
EN/LZT 146 343 R2B May 2007
Ericsson Power Modules AB
Technical Specication
10
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