
Ericsson Internal
PRODUCT SPECIFICATION
4 (6)
Prepared (also subject responsible if other)
No.
MPM/BK Johan Hgberg/Conny Bckstrm
3/1301-BMR 653 Uen
Approved
Checked
Date
Rev
Reference
MPM/BK (Natalie Johansson)
(MICANWO) 2007-05-03
G
Thermal Consideration
General
The product is designed to operate in various thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
Cooling is achieved mainly by conduction, from the pins to
the host board, and convection. The size and copper
thickness of the host board will have impact on the
Conduction cooling. Convection cooling is dependant on the
airflow across the DC/DC converter. Increased airflow
enhances the cooling of the DC/DC converter.
The Output Current Derating graph found in the Output
section for each model provides the available output current
vs. ambient air temperature and air velocity at Vin = 53 V.
The DC/DC converter is tested on a 254 x 254 mm,
35 μm (1 oz), 16-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
Proper cooling of the DC/DC converter can be verified by
measuring the temperature at reference point. The
temperature at these positions should not exceed the max
values provided in the table below.
Position
Device
Designation
max value
Reference
PCB
-
130°C
Top view
Definition of reference temperature (Tref)
The reference temperature is used to monitor the temperature
limits of the product. Temperatures above maximum Tref are
not allowed and may cause degradation or permanent
damage to the product. Tref is also used to define the
temperature range for normal operating conditions.
Tref is defined by the design and used to guarantee safety
margins, proper operation and reliability of the module.
Ambient Temperature Calculation
By using the thermal resistance the estimated maximum
allowed ambient temperature can be calculated.
1. The power loss is calculated by using the formula
((1/η) - 1) × output power = power losses (Pd).
η = efficiency of converter. E.g 96 % = 0.96
2. Find the thermal resistance (Rth) in the Thermal Resistance
graph found in the Output section for each model.
Calculate the temperature increase (ΔT).
ΔT = Rth x Pd
3. Max allowed ambient temperature is:
Ta=Max Tref - ΔT.
E.g. PKM4204B PI at 53Vin 20Aout 1.5 m/s
1. ((1/0.96) — 1) x 240W = 10 W
2. 10 W x 3.8o C = 38o C
3. 130o C — 38o C = max ambient temperature is 92o C
The actual temperature will be dependent on several factors
such as the PCB size, number of layers and direction of
airflow.
E
PKM4000B PI
Intermediate Bus Converters, Input 36-75 V,12V/33A
EN/LZT 146 305 R4B May 2007
Ericsson Power Modules AB
Technical Specication
16