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參數(shù)資料
| 型號： | PKJ4319PIP |
| 英文描述： | Analog IC |
| 中文描述： | 模擬IC |
| 文件頁數(shù)： | 4/20頁 |
| 文件大小： | 617K |
| 代理商： | PKJ4319PIP |
Thermal Data
The PKJ series DC/DC power modules has a robust thermal design
which allows operation at case (baseplate) temperatures (T
C
) up to
+100°C. The main cooling mechanism is convection (free or forced)
through the case or optional heatsinks.
The graph above shows the allowable maximum output
current to maintain a maximum +100°C case temperature.
Note that the ambient temperature is the air temperature
adjacent to the power module which is typically elevated
above the room environmental temperature.
The graphs below can be used to estimate case temperatures
for given system operating conditions (see Thermal design).
For further information on optional heatsinks, please contact
your local Ericsson sales office.
Thermal Design
The thermal data can be used to determine thermal performance
without a heatsink.
Case temperature is calculated by the following formula:
T
C
= T
A
+ P
d
x R
thC-A
where P
d
= P
O
(1/
η
- 1)
Where:
T
C
: Case Temperature
T
A
: Local Ambient Temperature
P
d
: Dissipated Power
R
thC-A
: Thermal Resistance from T
C
to T
A
The efficiency
η
can be found in the tables on the following pages.
For design margin and to enhance system reliability, it is recommend-
ed that the PKJ series DC/DC power modules are operated at case
temperatures below 90°C.
4
Data Sheet AE/LZT 137 57 R1 Ericsson Components AB, August 1999
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