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參數(shù)資料
| 型號： | PKD4510ASI |
| 廠商： | ERICSSON POWER MODULES AB |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 50 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT, SMD-24 |
| 文件頁數(shù)： | 8/18頁 |
| 文件大?。?/td> | 570K |
| 代理商： | PKD4510ASI |
Ericsson Internal
PRODUCT SPECIFICATION
2 (5)
Prepared (also subject responsible if other)
No.
MICUPEZ
4/1301-BMR 622 Uen
Approved
Checked
Date
Rev
Reference
M. Anderzen
See § 1
2006-03-14
B
Soldering Information - Surface mounting
The product is intended for convection or vapor phase reflow
SnPb [and/or] Pb-free processes. To achieve a good and
reliable soldering result, make sure to follow the
recommendations from the solder paste supplier, to use
state-of-the-art reflow equipment and reflow profiling
techniques as well as the following guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product. The cleaning
residues may affect long time reliability and isolation voltage.
A sufficiently extended preheat time is recommended to
ensure an even temperature across the host PCB, for both
small and large devices. To reduce the risk of excessive
heating is also recommended to reduce the time in the reflow
zone as much as possible.
Minimum pin temperature recommendations
Pin number 22 is chosen as reference location for the
minimum pin temperature recommendations.
SnPb solder processes
For Pb solder processes, a pin temperature (T
PIN) in excess of
the solder melting temperature, (T
L, +183°C for Sn63/Pb37)
for more than 30 seconds, and a peak temperature of +210°C
is recommended to ensure a reliable solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN) in
excess of the solder melting temperature (T
L, +217 to +221 °C
for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
SnPb solder processes
For conventional SnPb solder processes, the product is
qualified for MSL 1 according to IPC/JEDEC standard
J-STD-020C.
During reflow, T
Pin must not exceed +235 °C at any time.
Min 10 s over 200 °C
30-100 s over 183 °C
Lead-free (Pb-free) solder processes- TBD AFTER REVIEW
For Pb-free solder processes, the product is qualified for
MSL 1 according to IPC/JEDEC standard J-STD-020C.
During reflow, T
Pin must not exceed +260 °C at any time.
max 20 s over 230 °C
30-100 s over 221 °C
25 °C
Time
Temperature
Ramp-down
(cooling)
Ramp-up
Reflow
Preheat
Time 25 °C to peak
T
P
T
L
Profile features
Sn/Pb eutectic
assembly
Pb-free assembly
Average ramp-up rate
3 °C/s max
Solder melting
temperature (typical)
T
L
+183 °C
+221 °C
Peak product temperature T
P
+235 °C
+260 °C
Average ramp-down rate
4 °C/s max
Time 25 °C to peak
temperature
6 minutes max
8 minutes max
E
PKD 4000 ASI series
DC/DC converters, Input 36-75 V, Output 20 A/50 W
EN/LZT 146 346 R1A April 2006
Ericsson Power Modules AB
Technical Specication
16
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PKD4510ESI | 功能描述:DC/DC轉(zhuǎn)換器 3.3 Vdc 15A Iso Input 36-75V 50W RoHS:否 制造商:Murata 產(chǎn)品: 輸出功率: 輸入電壓范圍:3.6 V to 5.5 V 輸入電壓（標(biāo)稱）: 輸出端數(shù)量:1 輸出電壓（通道 1）:3.3 V 輸出電流（通道 1）:600 mA 輸出電壓（通道 2）: 輸出電流（通道 2）: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體尺寸: |
| PKD480 | 制造商:Pyle 功能描述:1 Diameter 200W Max Tweeter Dynamic Horn 制造商:PYLE 功能描述:TWEETER DYNAMIC HORN 1 DIAMETER 200W MAX |
| PKD60B1/4 | 功能描述:旋鈕和轉(zhuǎn)盤 STRGHT 0.8" W/SKIRT SWITCH KNOB RoHS:否 制造商:Davies Molding 材料:Phenolic 設(shè)計(jì):Set Screw 軸尺寸:0.25 in 直徑:3/4 in 顏色:Black 指示器型式:Line |
| PKD60B1/8 | 功能描述:旋鈕和轉(zhuǎn)盤 STRGHT 0.8" W/SKIRT SWITCH KNOB RoHS:否 制造商:Davies Molding 材料:Phenolic 設(shè)計(jì):Set Screw 軸尺寸:0.25 in 直徑:3/4 in 顏色:Black 指示器型式:Line |
| PKD60B101/4 | 制造商:TE Connectivity 功能描述:Switch Access Rotary Switch Round Knob |
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