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Ericsson Internal
PROD. SPECIFICATION MECHANICAL
2 (4)
Prepared (also subject responsible if other)
No.
MICJAN
5/1301-BMR 655 Uen
Approved
Checked
Date
Rev
Reference
MPM/BK/P [Natalie Johansson]
See §1
2007-05-29
B
Soldering Information — Through Hole Mounting
The through hole mount version of the product is intended for
manual or wave soldering. When wave soldering is used, the
temperature on the pins is specified to maximum 270°C for
maximum 10 seconds.
A maximum preheat rate of 4°C/s and a temperature of max
+150°C is suggested. When soldering by hand, care should
be taken to avoid direct contact between the hot soldering
iron tip and the pins for more than a few seconds in order to
prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may affect
long time reliability and isolation voltage.
Delivery Package Information, Surface Mount
Version
The surface mount versions of the products are delivered in
antistatic injection molded trays (Jedec design guide 4.10D
standard.
Tray Specifications
Material
PPE, Antistatic
Surface resistance
105 < Ohm/square < 1012
Bakability
The trays can be baked at maximum
125°C for 48 hours
Tray capacity
20 products/tray
Tray thickness
14.4 mm [0.567 inch]
Box capacity
100 products (5 full trays/box)
Tray weight
110 g empty, 530 g full tray
Dry Pack Information
The surface mount versions of the products are delivered in
trays These inner shipment containers are dry packed in
standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Delivery Package Information, Through Hole
versions
The products are delivered in antistatic trays.
Tray Specifications
Material
PE foam, antistatic.
Surface resistance
105 < Ohm/square < 1012
Bakability
The trays are not bakable
Tray capacity
25 products/tray
Tray thickness Open
Frame version
18 mm [0.71 inch]
Tray thickness Base
Plate version
22 mm [0.87 inch]
Box capacity Open
Frame version
100 products (4 full trays/box)
Box capacity Base Plate
version
50 products (2 full trays/box)
Tray weight Open Frame
version
30 g empty, 550 g full tray
Tray weight Base Plate
version
40 g empty, 1040 g full tray
E
PKB4000C PI
DC/DC converters, Input 36-75 V, Output 60A/144W
EN/LZT 146 377 R3G
Oct 2008
Ericsson Power Modules AB
Technical Specification
38