2005 Microchip Technology Inc.
DS39612B-page 329
PIC18F6525/6621/8525/8621
Module Differential Currents (
IWDT, IBOR, ILVD, IOSCB, IAD)
D022
(
IWDT)
Watchdog Timer
<1
2.0
A-40°C
VDD = 2.0V
<1
2
A+25°C
520
A+85°C
310
A-40°C
VDD = 3.0V
320
A+25°C
10
35
A+85°C
12
25
A-40°C
VDD = 5.0V
15
35
A+25°C
20
50
A+85°C
D022A
(
IBOR)
Brown-out Reset(4)
55
115
A-40°C to +85°CVDD = 3.0V
105
175
A-40°C to +85°CVDD = 5.0V
D022B
(
ILVD)
Low-Voltage Detect(4)
45
125
A-40°C to +85°CVDD = 2.0V
45
150
A-40°C to +85°CVDD = 3.0V
45
225
A-40°C to +85°CVDD = 5.0V
D025
(
IOSCB)
Timer1 Oscillator
20
27
A-10°C
20
30
A+25°CVDD = 2.0V
32 kHz on Timer1
25
35
A+70°C
22
60
A-10°C
22
65
A+25°CVDD = 3.0V
32 kHz on Timer1
25
75
A+70°C
30
75
A-10°C
30
85
A+25°CVDD = 5.0V
32 kHz on Timer1
35
100
A+70°C
D026
(
IAD)
A/D Converter
<1
2
A+25°CVDD = 2.0V
<1
2
A+25°CVDD = 3.0V
A/D on, not converting
<1
2
A+25°CVDD = 5.0V
27.2
DC Characteristics: Power-Down and Supply Current
PIC18F6X2X/8X2X (Industrial, Extended)
PIC18LF6X2X/8X2X (Industrial) (Continued)
PIC18LF6X2X/8X2X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
PIC18F6X2X/8X2X
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40°C
≤ TA ≤ +85°C for industrial
-40°C
≤ TA ≤ +125°C for extended
Param
No.
Device
Typ
Max
Units
Conditions
Legend:
Shading of rows is to assist in readability of the table.
Note
1:
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2:
The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3:
For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k
.
4:
The band gap reference is a shared resource used by both BOR and LVD modules. Enabling both modules will
consume less than the specified sum current of the modules.