參數(shù)資料
型號: PIC18F44J10-I/ML
廠商: Microchip Technology
文件頁數(shù): 69/80頁
文件大?。?/td> 0K
描述: IC PIC MCU FLASH 8KX16 44QFN
產品培訓模塊: Asynchronous Stimulus
PIC18 J Series MCU Overview
8-bit PIC® Microcontroller Portfolio
標準包裝: 45
系列: PIC® 18F
核心處理器: PIC
芯體尺寸: 8-位
速度: 40MHz
連通性: I²C,SPI,UART/USART
外圍設備: 欠壓檢測/復位,POR,PWM,WDT
輸入/輸出數(shù): 32
程序存儲器容量: 16KB(8K x 16)
程序存儲器類型: 閃存
RAM 容量: 1K x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 3.6 V
數(shù)據轉換器: A/D 13x10b
振蕩器型: 內部
工作溫度: -40°C ~ 85°C
封裝/外殼: 44-VQFN 裸露焊盤
包裝: 管件
產品目錄頁面: 642 (CN2011-ZH PDF)
配用: AC162074-ND - HEADER INTRFC MPLAB ICD2 44TQFP
MA180013-ND - MODULE PLUG-IN 18F45J10 44TQFP
AC162067-ND - HEADER INTRFC MPLAB ICD2 40/28P
XLT44QFN2-ND - SOCKET TRAN ICE 44QFN/40DIP
Micrel, Inc.
KSZ8851SNL/SNLI
August 2009
71
M9999-083109-2.0
Absolute Maximum Ratings
(1)
Supply Voltage (VDD_A3.3, VDD_IO) ......... –0.5V to +4.0V
Input Voltage (All Inputs).............................. –0.5V to +4.0V
Output Voltage (All Outputs) ........................ –0.5V to +4.0V
Lead Temperature (soldering, 20sec.) ....................... 260°C
Storage Temperature (Ts) ......................... –65°C to +150°C
Maximum Junction Temperature (TJ)....................... +125°C
HBM ESD Rating .......................................................... 6KV
Operating Ratings
(2)
Supply Voltage
VDD_A3.3 .......................................... +3.1V to +3.5V
VDD_IO (3.3V) ................................... +3.1V to +3.5V
VDD_IO (2.5V) ............................... +2.35V to +2.65V
VDD_IO (1.8V) ................................... +1.7V to +1.9V
Ambient Operating Temperature (TA)
Commercial (SNL)…………….……………...0°C to +70°C
Industrial (SNLI)……………….…………...-40°C to +85°C
Thermal Resistance
(3)
Junction-to-Ambient (
θ
JA) ...............................34°C/W
Junction-to-Case (
θ
JC) ......................................6°C/W
Electrical Characteristics
(4, 5)
Symbol
Parameter
Condition
Min
Typ
Max
Units
Supply Current for 100BASE-TX Operation (Single Port@100% Utilization)
VDD_A3.3, VDD_IO = 3.3V; Chip only (no
transformer)
85
mA
VDD_A3.3=3.3V, VDD_IO = 2.5V; Chip only
(no transformer)
85
mA
Idd1
100BASE-TX
(analog core + PLL + digital
core + transceiver + digital I/O)
VDD_A3.3=3.3V, VDD_IO = 1.8V; Chip only
(no transformer)
85
mA
Supply Current for 10BASE-T Operation ( Single Port@100% Utilization)
VDD_A3.3, VDD_IO = 3.3V; Chip only (no
transformer)
75
mA
VDD_A3.3=3.3V, VDD_IO = 2.5V; Chip only
(no transformer)
75
mA
Idd2
10BASE-T
(analog core + PLL + digital
core + transceiver + digital I/O)
VDD_A3.3=3.3V, VDD_IO = 1.8V; Chip only
(no transformer)
75
mA
Power Management Mode
Idd3
Power Saving Mode
(6)
Ethernet cable disconnected & Auto-Neg
70
mA
Idd4
Soft Power Down Mode
Set Bit [1:0] = 10 in PMECR register
2
mA
Idd5
Energy Detect Mode
At low power state
2
mA
TTL Inputs (VDD_IO = 3.3V/2.5V/1.8V)
VIH
Input High Voltage
2.0/2.0
/1.3
V
VIL
Input Low Voltage
0.8/0.6
/0.3
V
IIN
Input Current
VIN = GND ~ VDD_IO
-10
10
A
TTL Outputs (VDD_IO = 3.3V/2.5V/1.8V)
VOH
Output High Voltage
IOH = -8mA
2.4/1.9
/1.5
V
VOL
Output Low Voltage
IOL = 8mA
0.4/0.4
/0.2
V
|IOZ|
Output Tri-state Leakage
10
A
Notes:
1.
Exceeding the absolute maximum rating may damage the device.
2.
The device is not guaranteed to function outside its operating rating. Unused inputs must always be tied to a appropriate logic voltage level (Ground
to VDD_IO).
3.
No (HS) heat spreader in this package. The
θ
JCJA is under air velocity 0m/s.
4.
TA = 25°C. Specification for packaged product only.
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