![](http://datasheet.mmic.net.cn/Microchip-Technology/PIC17C44-33-L_datasheet_99509/PIC17C44-33-L_210.png)
PIC17C4X
DS30412C-page 210
1996 Microchip Technology Inc.
21.6
Package Marking Information
44-Lead TQFP
XXXXXXXXXX
AABBCDE
XXXXXXXXXX
44-Lead PLCC
XXXXXXXXXX
AABBCDE
XXXXXXXXXX
XXXXXXXXXXXXXXXXXX
AABBCDE
40-Lead PDIP/CERDIP
XXXXXXXXXXXXXXXXXX
XXXXXXXXXXX
AABBCDE
40 Lead CERDIP Windowed
XXXXXXXXXXX
Example
-25/TQ
9450CAT
PIC17C44
L247
Example
PIC17C42
9445CCN
-16I/L
L013
L006
9441CCA
Example
PIC17C43-25I/P
PIC17C44
9444CCT
Example
L184
/JW
Legend: MM...M
Microchip part number information
XX...X
Customer specic information*
AA
Year code (last 2 digits of calendar year)
BB
Week code (week of January 1 is week ‘01’)
C
Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.,
S = Tempe, Arizona, U.S.A.
D
Mask revision number
E
Assembly code of the plant or country of origin in which
part was assembled
Note:
In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specic information.
*
Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales
Ofce. For QTP devices, any special marking adders are included in QTP
price.
44-Lead MQFP
XXXXXXXXXX
AABBCDE
XXXXXXXXXX
Example
-25/PT
9450CAT
PIC17C44
L247