參數(shù)資料
型號(hào): PIC16LF871-I/PT
廠商: Microchip Technology
文件頁數(shù): 23/143頁
文件大小: 0K
描述: IC PIC MCU FLASH 2KX14 44TQFP
產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
8-bit PIC® Microcontroller Portfolio
標(biāo)準(zhǔn)包裝: 160
系列: PIC® 16F
核心處理器: PIC
芯體尺寸: 8-位
速度: 20MHz
連通性: UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 33
程序存儲(chǔ)器容量: 3.5KB(2K x 14)
程序存儲(chǔ)器類型: 閃存
EEPROM 大小: 64 x 8
RAM 容量: 128 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 44-TQFP
包裝: 托盤
產(chǎn)品目錄頁面: 639 (CN2011-ZH PDF)
2003 Microchip Technology Inc.
DS30569B-page 117
PIC16F870/871
14.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias................................................................................................................ .-55 to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR. and RA4) ......................................... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS ............................................................................................................ -0.3 to +7.5V
Voltage on MCLR with respect to VSS (Note 2) ............................................................................................0 to +13.25V
Voltage on RA4 with respect to Vss ..................................................................................................................0 to +8.5V
Total power dissipation (Note 1) ............................................................................................................................... 1.0W
Maximum current out of VSS pin ........................................................................................................................... 300 mA
Maximum current into VDD pin .............................................................................................................................. 250 mA
Input clamp current, IIK (VI < 0 or VI > VDD)
..................................................................................................................... ± 20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
............................................................................................................. ± 20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin .................................................................................................... 25 mA
Maximum current sunk by PORTA, PORTB, and PORTE (combined) (Note 3) ................................................... 200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (combined) (Note 3).............................................. 200 mA
Maximum current sunk by PORTC and PORTD (combined) (Note 3) .................................................................200 mA
Maximum current sourced by PORTC and PORTD (combined) (Note 3) ............................................................ 200 mA
Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD -
∑ IOH} + ∑ {(VDD - VOH) x IOH} + ∑(VOl x IOL)
2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up.
Thus, a series resistor of 50-100
should be used when applying a “l(fā)ow” level to the MCLR pin, rather than
pulling this pin directly to VSS.
3: PORTD and PORTE are not implemented on the 28-pin devices.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
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