參數(shù)資料
型號(hào): PIC16F57-I/SS
廠商: Microchip Technology
文件頁數(shù): 80/88頁
文件大?。?/td> 0K
描述: IC MCU FLASH 2KX12 28SSOP
產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
8-bit PIC® Microcontroller Portfolio
標(biāo)準(zhǔn)包裝: 47
系列: PIC® 16F
核心處理器: PIC
芯體尺寸: 8-位
速度: 20MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 20
程序存儲(chǔ)器容量: 3KB(2K x 12)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 72 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
振蕩器型: 外部
工作溫度: -40°C ~ 85°C
封裝/外殼: 28-SSOP(0.209",5.30mm 寬)
包裝: 管件
產(chǎn)品目錄頁面: 638 (CN2011-ZH PDF)
配用: AC164307-ND - MODULE SKT FOR PM3 28SSOP
AC164014-ND - MODULE SKT PROMATEII 44PQFP
2007 Microchip Technology Inc.
DS41213D-page 79
PIC16F5X
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
N
44
Lead Pitch
e
0.80 BSC
Overall Height
A
1.20
Molded Package Thickness
A2
0.95
1.00
1.05
Standoff
A1
0.05
0.15
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
3.5°
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.09
0.20
Lead Width
b
0.30
0.37
0.45
Mold Draft Angle Top
α
11°
12°
13°
Mold Draft Angle Bottom
β
11°
12°
13°
A
E
E1
D
D1
e
b
NOTE 1
NOTE 2
N
12 3
c
A1
L
A2
L1
α
φ
β
Microchip Technology Drawing C04-076B
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PIC16F57T-E/SO 功能描述:8位微控制器 -MCU 3KB 72 RAM 20 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F57T-E/SS 功能描述:8位微控制器 -MCU 3KB 72 RAM 20 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16F57T-I/ML 制造商:Microchip Technology Inc 功能描述:28 PIN, 3KB STD FLASH, 72 RAM, 20 I/O - Tape and Reel
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PIC16F57T-I/SO-CUT TAPE 制造商:Microchip 功能描述:PIC16 Series 72 B RAM 3 kB Flash 8-Bit CMOS Microcontroller - SOIC-28