參數(shù)資料
型號(hào): PIC16F57-E/SP
廠商: Microchip Technology
文件頁(yè)數(shù): 73/88頁(yè)
文件大?。?/td> 0K
描述: IC MCU FLASH 2KX12 28-DIP
產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
標(biāo)準(zhǔn)包裝: 15
系列: PIC® 16F
核心處理器: PIC
芯體尺寸: 8-位
速度: 20MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 20
程序存儲(chǔ)器容量: 3KB(2K x 12)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 72 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
振蕩器型: 外部
工作溫度: -40°C ~ 125°C
封裝/外殼: 28-DIP(0.300",7.62mm)
包裝: 管件
2007 Microchip Technology Inc.
DS41213D-page 73
PIC16F5X
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
20
Pitch
e
0.65 BSC
Overall Height
A
2.00
Molded Package Thickness
A2
1.65
1.75
1.85
Standoff
A1
0.05
Overall Width
E
7.40
7.80
8.20
Molded Package Width
E1
5.00
5.30
5.60
Overall Length
D
6.90
7.20
7.50
Foot Length
L
0.55
0.75
0.95
Footprint
L1
1.25 REF
Lead Thickness
c
0.09
0.25
Foot Angle
φ
Lead Width
b
0.22
0.38
φ
L
L1
A2
c
e
b
A1
A
12
NOTE 1
E1
E
D
N
Microchip Technology Drawing C04-072B
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