參數(shù)資料
型號： PIC16CR64
英文描述： PIC16CR64 Rev. A Silicon Errata
中文描述： PIC16CR64版本A的芯片勘誤表
文件頁數(shù)： 64/67頁
文件大?。?/td> 2723K
代理商： PIC16CR64
Rev. 2.0, 03/06/02, 58
3.10
Generating a Makefile
The HEW allows you to generate a makefile, which can be used to build parts of your workspace without HEW.
This is particularly useful of you want to send a project to a user who does not have the HEW or if you want to
version control an entire build, including the make components.
To generate a makefile:
1. Ensure that the project, which you want to generate a makefile for, is the current project.
2. Ensure that the build configuration that you want to build the project with is the current configuration.
3.
Select [Build>Generate Makefile].
4.
Once this menu has been selected a dialog is displayed which asks the user what parts of the workspace
need to be added to the make file. (See figure 3.23.)
5.
Select the radio button which is relevant for your make file and then click OK.
Figure 3.23: Generate makefile Dialog
The HEW will create a subdirectory “make” within the current workspace directory and then generate the
makefile into it. It is named after the selection, with a .mak extension for example the current project and
configuration(e.g. project_debug.mak). The executable HMAKE.EXE, located in the HEW installation directory,
is provided for you to execute the makefiles generated by the HEW. It is not intended to execute makefiles,
which have been user modified.
To execute a makefile:
1. Open a command window and change to the “make” directory where the makefile was generated.
2. Execute HMAKE. Its command line is HMAKE.EXE <makefile>.
Note:
The degree portability of a generated makefile is entirely dependent upon how portable the project itself
is. For example, any compiler options, which include full paths to an output directory or include file
directory, will mean that, when given to another user with a different installation, the build will probably
fail. In general use placeholders wherever possible – using a full, specific path should be avoided when
possible.
相關(guān)PDF資料
PDF描述
PIC16CR63 Complete Mid-Range Reference Manual
PIC16F877-04IPQ 8-BIT MICROCONTROLLER
PIC16F877-04IP301 Microcontroller
PIC16F874T-04PT 8-BIT MICROCONTROLLER
PIC16F874T-04PQ301 Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16CR73-I/ML 功能描述:IC PIC MCU 4KX14 28QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:PIC® 16C 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP
PIC16CR73-I/SO 功能描述:IC PIC MCU 4KX14 28SOIC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:PIC® 16C 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP
PIC16CR73-I/SP 功能描述:IC PIC MCU 4KX14 28DIP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:PIC® 16C 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP
PIC16CR73-I/SS 功能描述:IC PIC MCU 4KX14 28SSOP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:PIC® 16C 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP
PIC16CR73T-I/ML 功能描述:IC PIC MCU 4KX14 28QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:PIC® 16C 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設(shè)備:欠壓檢測/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲器容量:8KB（4K x 16） 程序存儲器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*