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參數(shù)資料
| 型號： | PIC16C774-E/PT |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 13/31頁 |
| 文件大小： | 0K |
| 描述： | IC MCU OTP 4KX14 A/D PWM 44TQFP |
| 標準包裝： | 160 |
| 系列： | PIC® 16C |
| 核心處理器： | PIC |
| 芯體尺寸： | 8-位 |
| 速度： | 20MHz |
| 連通性： | I²C，SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復(fù)位，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 33 |
| 程序存儲器容量： | 7KB（4K x 14） |
| 程序存儲器類型： | OTP |
| RAM 容量： | 256 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 4 V ~ 5.5 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 10x12b |
| 振蕩器型： | 外部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 44-TQFP |
| 包裝： | 托盤 |
| 其它名稱： | PIC16C774E/PT |
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PCA9534_3
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 03 — 6 November 2006
20 of 25
NXP Semiconductors
PCA9534
8-bit I2C-bus and SMBus low power I/O port with interrupt
13. Handling information
Inputs and outputs are protected against electrostatic discharge in normal handling.
However, to be completely safe you must take normal precautions appropriate to handling
integrated circuits.
14. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus PbSn soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
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|---|---|
| PIC16C774-I/L | 功能描述:8位微控制器 -MCU 7KB 256 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
| PIC16C774-I/P | 功能描述:8位微控制器 -MCU 7KB 256 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
| PIC16C774-I/P | 制造商:Microchip Technology Inc 功能描述:IC 8BIT CMOS MCU 16C774 DIP40 |
| PIC16C774-I/PQ | 功能描述:8位微控制器 -MCU 7KB 256 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
| PIC16C774-I/PT | 功能描述:8位微控制器 -MCU 7KB 256 RAM 33 I/O RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:50 MHz 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風格:SMD/SMT |
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